High performance hybrids based on a novel incompletely condensed polyhedral oligomeric silsesquioxane and bismaleimide resin with improved thermal and dielectric properties

Zeng, Lingmin; Liang, Guozheng; Gu, Aijuan; Yuan, Li; Zhuo, Dongxian; Hu, Jiangtao

doi:10.1007/s10853-011-6078-3

Cited by 29 publications

(14 citation statements)

References 39 publications

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“…Cyanate ester (CE) resin possesses excellent dielectric property, thermal resistance, good flame-retardancy and so on [18][19][20][21]. Therefore, CE resin has been gained great attentions.…”

Section: Introductionmentioning

confidence: 99%

Thermal conductivity and dielectric properties of bismaleimide/cyanate ester copolymer

Wan

Zhang

et al. 2017

High Voltage

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The blend was synthesised with bismaleimide (BMI) resin and bisphenol A-based cyanate ester (BADCy) resin. The BMI/BADCy copolymer showed excellent dielectric and thermal conductivity properties. The volume resistivity of the copolymer was a little lower than BADCy system. The volume resistivity of blend was 7.8 × 10 15 Ω•cm when the BMI content was 20 wt%, which still showed good insulation performance. The dielectric property of modified BADCy copolymer remained the good stability from 0.1 Hz to 1 MHz. Compared to pure BADCy system, the breakdown property of BMI/BADCy blend reached the maximum value of 77.9 kV/mm when the content of BMI was 20 wt%, which was still about 1.22 times. The thermal property and thermal conductivity property of the copolymer were higher than BADCy system.

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Section: Introductionmentioning

confidence: 99%

Thermal conductivity and dielectric properties of bismaleimide/cyanate ester copolymer

Wan

Zhang

et al. 2017

High Voltage

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“…At the same time, the SiOSi peak at 1101 cm −1 still appeared after curing, which confirms that the cage structure made up of SiOSi bond was very stable. In addition, OH stretching of ECN was found at 3469 cm −1 due to the reaction between ECN and OAPS .…”

Section: Resultsmentioning

confidence: 98%

“…The incorporation of POSS into EP can improve their thermal resistance, mechanical strength, dielectric properties, flame retardancy . Nowadays, many authors have reported that EP modified by POSS through curing process promotes an improvement in use properties . The representative work was carried out by Chen's group , in which the nanocomposites involving diglycidyl ether of bisphenol A and octaaminophenyl polyhedral oligomeric silsesquioxane (OAPS) were prepared.…”

Section: Introductionmentioning

confidence: 99%

Preparation and properties of polyhedral oligomeric silsesquioxane/epoxy hybrid resins

Ding

Dong

et al. 2013

Polym. Compos.

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Octaaminophenyl polyhedral oligomeric silsesquioxane (OAPS) was synthesized using three-step method and used to modify o-cresol-novolac epoxy resin (ECN) for printed circuit board. The influence of OAPS on the reactivity and the final properties of the hybrid networks were evaluated. The intercrosslinking reaction between ECN and OAPS was confirmed by Fourier transform infrared spectra. The ECN/OAPS hybrids have better impact strength, higher electrical resistivity and thermal stability, lower water absorption than the unmodified ECN. The volume resistivity and surface resistivity of the hybrids increase by an order of magnitude or more compared to the neat epoxy. The thermal stability of the hybrids improves by the incorporation of OAPS; the initial decomposition temperature and char yield show an increasing tendency up to 4 wt% loading of OAPS. The hybrids exhibit higher storage modulus and glass transition temperature (T g ) than the neat epoxy. The T g of the hybrids greatly improves up to 153.3 C at 3 wt% content, much higher than 119.4 C of the neat epoxy.

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“…In particular, the molecular hybrids based on polyhedral oligomeric silsesquioxanes (POSS) that has well defined nanometer‐sized cube‐like structures with porous inorganic core surrounded by eight organic corner groups (active or inert), can effectively overcome the difficulty to disperse the particles into organic/polymer matrix uniformly via covalent bonding . As a result, the incorporation of POSS has led to enhancement in the physical properties of materials such as thermal and mechanical stability, flammability, oxidative resistance, and low dielectric constant . Thus POSS‐based hybrids have been widely studied in many areas of potential use, such as luminescence emission, nonlinear optics, resist coatings for lithography, laser protection, integrated circuits industry as low dielectric constant materials, and so on …”

Section: Introductionmentioning

confidence: 99%

POSS‐based molecular hybrids with low dielectric constant: Effect of chemical structure and molecular architecture

Zhang

Guang

et al. 2015

J of Applied Polymer Sci

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Three kinds of hybrids with different architectures including dumbbell-type, bead-type, and cross-linked structure, were prepared via the Heck reaction between octavinyl-polyhedral oligomeric silsesquioxane (OV-POSS) and different bromo-substituted aromatic amide monomers. The molecular architecture can be successfully achieved by simply varying the feed ratio of OV-POSS to monomers. Their structure and properties were characterized by FTIR, 1 H NMR, 29 Si NMR, provide the expansion for FTIR and NMR] All the POSS-based hybrids exhibited good thermal stability and low dielectric constant properties. The relationship between chemical structure, molecular architecture, and the dielectric constant of these hybrids were investigated in detail. The results show that POSS content dominated the low dielectric constant of the hybrids, while the chemical structure of organic chains and molecular architecture also play an important role on the formation of low dielectric constant.

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High performance hybrids based on a novel incompletely condensed polyhedral oligomeric silsesquioxane and bismaleimide resin with improved thermal and dielectric properties

Cited by 29 publications

References 39 publications

Thermal conductivity and dielectric properties of bismaleimide/cyanate ester copolymer

Thermal conductivity and dielectric properties of bismaleimide/cyanate ester copolymer

Preparation and properties of polyhedral oligomeric silsesquioxane/epoxy hybrid resins

POSS‐based molecular hybrids with low dielectric constant: Effect of chemical structure and molecular architecture

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