High‐resolution resist for screen printing: application to direct fabrication of Ag circuit

Abstract

High‐resolution screen printing was devised. New resist formulation contains a base polymer, which consists of acid‐labile tetrahydropyranyl‐protected carboxylic acid, hydroxyl, and methacrylic functions. As crosslinkers, multifunctional acrylates were employed. Photoacid generators were used for pattern formation. A 10‐µm feature size of resist on a screen plate was obtained on irradiation at 365 nm and followed by development on a stainless steel screen. Post‐exposure curing improved the mechanical characteristics of the resist patterns. A 13‐µm feature size silver circuit was successfully printed on poly(ethylene terephthalate) film without defect. Copyright © 2011 John Wiley & Sons, Ltd.

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