High-speed serial differential signaling links with commercial equalizer

Sevcik, Bretislav

doi:10.1109/radioelek.2010.5478561

Cited by 3 publications

(1 citation statement)

References 2 publications

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“…The single layer bandwidth density is evaluated first, which means that there is only one layer in the board. We express the bandwidth density in Equation (17). Here B is the maximum bandwidth of each interconnect, and p is the interconnect pitch.…”

Section: B Bandwidth Densitymentioning

confidence: 99%

Alleviate chip I/O pin constraints for multicore processors through optical interconnects

Wang

Yang

et al. 2015

The 20th Asia and South Pacific Design Automation Conference

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Chip I/O pins are an increasingly limited resource and significantly affect the performance, power and cost of multicore processors. Optical interconnects promise low power and high bandwidth, and are potential alternatives to electrical interconnects. This work systematically developed a set of analytical models for electrical and optical interconnects to study their structures, receiver sensitivities, crosstalk noises, and attenuations. We verified the models by published implementation results. The analytical models quantitatively identified the advantages of optical interconnects in terms of bandwidth, energy consumption, and transmission distance. We showed that optical interconnects can significantly reduce chip pin counts. For example, compared to electrical interconnects, optical interconnects can save at least 92% signal pins when connecting chips more than 25 cm (10 inches) apart.

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Section: B Bandwidth Densitymentioning

confidence: 99%

Alleviate chip I/O pin constraints for multicore processors through optical interconnects

Wang

Yang

et al. 2015

The 20th Asia and South Pacific Design Automation Conference

View full text Add to dashboard Cite

show abstract

Application of pulse-width modulated pre-emphasis in closely-spaced transmission lines with additional discontinuities

Sevcik

Brančík

2011

2011 IEEE EUROCON - International Conference on Computer as a Tool

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Transmitter pre-emphasis techniques to overcome high-slope losses of printed circuit board (PCB) with closelyspaced copper interconnect are presented. The pre-emphasis technique based on pulse-width modulation (PWM) using a timing resolution instead of an amplitude resolution to adjust the filter transfer function is presented. In addition only one coefficient can be used to set the equalizer transfer function depending on channel properties. The standard approaches to transmitter pre-emphasis, receiver equalization and PWM preemphasis are compared in advanced PCB backplane models.

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Time-domain pre-emphasis technique based on pulse-width modulation scheme

Sevcik

Brančík

2011

2011 34th International Conference on Telecommunications and Signal Processing (TSP)

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High-speed serial differential signaling links with commercial equalizer

Cited by 3 publications

References 2 publications

Alleviate chip I/O pin constraints for multicore processors through optical interconnects

Alleviate chip I/O pin constraints for multicore processors through optical interconnects

Application of pulse-width modulated pre-emphasis in closely-spaced transmission lines with additional discontinuities

Time-domain pre-emphasis technique based on pulse-width modulation scheme

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