2019
DOI: 10.1109/jphotov.2018.2878337
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High Temperature Annealing of ZnO:Al on Passivating POLO Junctions: Impact on Transparency, Conductivity, Junction Passivation, and Interface Stability

Abstract: We investigate the enhancement in transparency and conductivity of aluminum doped zinc oxide (ZnO:Al) layers upon high-temperature annealing and its impact on contact resistance as well as on passivation properties of carrier selective junctions based on doped polycrystalline Si on a passivating silicon oxide (POLO). The temperature stability of these junctions allows annealing of the ZnO:Al/POLO combination up to 600 °C. We prepare ZnO:Al films by DC magnetron sputtering at room temperature. We determine comp… Show more

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Cited by 20 publications
(19 citation statements)
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“…The TEM investigations presented in the next section will show that there are hints of Al diffusion in our samples as well. It is also good to note that in a similar study on sputtered ZnO:Al on poly-Si(n) passivating contacts, it was found that the contact resistivity increased strongly at an annealing temperature of 400 o C, which was attributed to the formation of 2-3 nm of SiO x at the TCO/poly-Si interface [73]. As TEM images will point out in the next section, in our case the interfacial oxide is only 1.1 nm after annealing at 400 o C but thickens upon annealing at 600 o C. Therefore it is well conceivable that this oxide contributes to the contact resistivity of especially the Al-doped films annealed at 500 o C.…”
Section: Contacting Of N-type Si Surfaces By Sio 2 /Zno(:al) Stacksmentioning
confidence: 80%
“…The TEM investigations presented in the next section will show that there are hints of Al diffusion in our samples as well. It is also good to note that in a similar study on sputtered ZnO:Al on poly-Si(n) passivating contacts, it was found that the contact resistivity increased strongly at an annealing temperature of 400 o C, which was attributed to the formation of 2-3 nm of SiO x at the TCO/poly-Si interface [73]. As TEM images will point out in the next section, in our case the interfacial oxide is only 1.1 nm after annealing at 400 o C but thickens upon annealing at 600 o C. Therefore it is well conceivable that this oxide contributes to the contact resistivity of especially the Al-doped films annealed at 500 o C.…”
Section: Contacting Of N-type Si Surfaces By Sio 2 /Zno(:al) Stacksmentioning
confidence: 80%
“…The first one is to reduce front poly‐Si thickness to d poly < 10 nm. At that point, a TCO transport layer will be necessary to ensure good fill‐factor . Another possible solution is to change the front side structure with either amorphous silicon or a lightly doped homojunction front surface field with poly‐Si passivating contacts only underneath the contacts.…”
Section: Resultsmentioning
confidence: 99%
“…At that point, a TCO transport layer will be necessary to ensure good fill-factor. [74][75][76] Another possible solution is to change the front side structure with either amorphous silicon or a lightly doped homojunction front surface field with poly-Si passivating contacts only underneath the contacts. Figure 14 shows the EQE of SC3, a hybrid solar cell from, 39 and a PeRFeCT solar cell from.…”
Section: Solar Cellsmentioning
confidence: 99%
“…In addition to good absorptivity, high conductivity is the prerequisite for their applications in electro-optic devices. An effective method to achieve these properties is doping with metals, especially elements of group III (Al, Ga), which have been shown to substitute Zn or O in the ZnO structure to enable n-type doping [4][5][6][7][8][9][10]. Employing a physical deposition approach, Sun et al [11] studied (Al, Co)-ZnO films cosputtered on glass substrate to reveal that (Co, Al) doping affects the carrier mobility due to the reduce crystallinity in the deposited films.…”
Section: Introductionmentioning
confidence: 99%