High temperature behaviour and reliability of Al-Ribbon for automotive applications

Milke, E.; Mueller, Tobias

doi:10.1109/estc.2008.4684384

Cited by 12 publications

(6 citation statements)

References 2 publications

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“…Celnikier et al [5] performed reliability tests for 2 PAK package using passive thermal cycling for ribbon bond and compared with wire bonds. In [9], the mechanical properties of Al-ribbon bonds such as tensile strength at different temperatures were investigated and using pressure cooker tests for high temperature storage and aging tests for reliability were performed. The high temperature storage tests showed low intermetallic compound (IMC) of 2 Cu formation as result of low diffusion and concluded that the risk of ribbon bond failure on direct copper bonding (DBC) caused by diffusion is very low, while the pull tests after thermal storage tests decreases with storage time caused by recrystallization softening of Al and copper Cu.…”

Section: Wire Bond Failure Modesmentioning

confidence: 99%

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Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules

Nwanoro

Yin

et al. 2017

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Aluminium wires are widely used in power electronics modules to connect power semiconductor devices and other parts of the module electrically. Recently, other interconnect techniques have been proposed such as ribbon bond to improve the reliability, performance and reduce costs of power modules. The reliability of ribbon bond technique for an IGBT power module under power cycling is compared with that of conventional wire bond in this study using electro-thermal nonlinear Finite Element Analysis. The results showed that a single ribbon of 2000μm x 200μm will replace three wire bonds of 400μm in diameter to achieve a similar module temperature distribution under same power load. Using the equivalent plastic strain increment per cycle, it is seen that the ribbon bond is more reliable than the wire bonds. The impact of neglecting joule heat in the wire/ribbon bonds during power cycling simulation has also been investigated.

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Section: Wire Bond Failure Modesmentioning

confidence: 99%

“…The life prediction model used for predicting the number of cycles to failure is given in (9) and is based on the equivalent plastic strain increment per cycle Δ ̅ [9].…”

Section: Life Prediction Modelmentioning

confidence: 99%

Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules

Nwanoro

Yin

et al. 2017

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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“…Instead, it is preferable to develop a module package with lower parasitic inductances. Several research groups and manufacturers have proposed to reduce the package inductance by replacing the traditional wire bond interconnections with ribbon [42], [43]; flexible PCB [44], [45], [46], [47], [48], solid posts, shims, or bumps [49], [50], [51]; solder balls [52]; directbonded solder [53]; or vias in PCB or ceramic substrates [54], [55], [56], [57]. Several packages also include integrated decoupling capacitors to mitigate the impact of stray inductances [55], [58], [59], [60], [61].…”

Section: Introductionmentioning

confidence: 99%

Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module

DiMarino

Mouawad

Johnson

et al. 2020

IEEE J. Emerg. Sel. Topics Power Electron.

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Wide-bandgap power devices with voltage ratings exceeding 10 kV have the potential to revolutionize medium-and high-voltage systems due to their high-speed switching and lower on-state losses. However, present power module packages are limiting the performance of these unique switches. The objective of this work is to push the boundaries of high-density, high-speed, 10 kV power module packaging. The proposed package addresses the well-known electromagnetic and thermal challenges, as well as the more recent and prominent electrostatic and electromagnetic interference issues associated with high-speed, 10 kV devices. The module achieves low and balanced parasitic inductances, resulting in a record switching speed of 250 V/ns with negligible ringing and voltage overshoot. An integrated screen reduces the commonmode current that is generated by these fast voltage transients by ten times. This screen connection simultaneously increases the partial discharge inception voltage by more than 50 %. A compact, medium-voltage termination and system interface design is also proposed in this work. With the integrated jet-impingement cooler, the power module prototype achieves a power density of 4 W/mm 3 . This paper presents the design, prototyping, and testing of this optimized package for 10 kV SiC MOSFETs.

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“…These limitations call for a new way to connect the top-sides of dies. Many academic and industrial researchers [2,3,4] tackle this issue, using copper [5] or aluminium [6] ribbons or a flexible Printed Circuit Board (PCB) [7] instead of aluminium wires, using pressed contacts made with spring-like metal wool [8] or made of plain metal [9,10].…”

Section: Introductionmentioning

confidence: 99%

Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam

Pascal

Labrousse

Petit

et al. 2018

Microelectronics Reliability

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A Printed Circuit Board (PCB)-embedding process using pressed metal foam to connect the top-side pads of power dies is considered. The manufacturing process, simple and highly cost-effective, is described in detail; samples are manufactured and their reliability and robustness are characterised. It is shown that thermally cycled prototypes exhibit reliability close to that of Direct Bounded Copper (DBC) substrates. Samples submitted to 150 A-surges have highly scattered reliability. SiC MOSFETs submitted to destructive current limiting tests and repetitive short-circuit tests performed similarly to dies reported in TO247 packages. A discussion on the development of reliability-assessment-methods, especially suited for PCB-embedding processes, is proposed.

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High temperature behaviour and reliability of Al-Ribbon for automotive applications

Cited by 12 publications

References 2 publications

Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules

Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules

Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module

Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam

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