High temperature electronics packaging: An overview of substrates for high temperature

Shaddock, David; Yin, Liang

doi:10.1109/iscas.2015.7168846

Cited by 7 publications

(8 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In addition, it is also possible to print and embed passive devices on LTCC and thick film boards. One of the advantages of LTCC over thick film is the number of metal layers, which is not limited by the successive screen printing process of metal and dielectric layers [26]. Therefore, considering the number of layers and routing density, LTCC is the best option from Table I for integration density.…”

Section: A Integration Densitymentioning

confidence: 99%

“…The symbols K and σ represent thermal and electrical conductivity respectively. Thick film boards have significantly better thermal performances than LTCC and PCB, thanks to aluminum nitride (AlN) and alumina (Al2O3) cores [26]. The via fill materials as well as the substrate for LTCC are more thermally conductive than for PCB.…”

Section: B Thermal Constraints and Lossesmentioning

confidence: 99%

See 1 more Smart Citation

Towards an LTCC SiP for Control System in Safety-Critical Applications

Nobert

Alameh

et al. 2021

2021 IEEE International Symposium on Circuits and Systems (ISCAS)

View full text Add to dashboard Cite

This paper presents a compact configurable power control system for safety-critical applications, which operates in harsh environments. This heterogeneous integrated mixed digital, analog and high-voltage design for power applications is implemented in a system-in-package (SiP) module using a lowtemperature co-fired ceramics (LTCC) substrate. A comparison between technologies for SiP designs shows that LTCC is advantageous in terms of integration density, thermal and electrical performances, as well as signal and power integrity. In addition, this work proposes layout and fabrication techniques for the enhancement of thermal, electrical performances and integration density specific to LTCC-based designs, such as chipcovering, multi-layer routing of power signals and self-damped transmission lines. An improvement of 59% in available area, 32% reduction of temperature due to self-heating, 65% loss reduction and 22% reduction in interference coupling were obtained when compared to a baseline design.

show abstract

Section: A Integration Densitymentioning

confidence: 99%

Section: B Thermal Constraints and Lossesmentioning

confidence: 99%

Towards an LTCC SiP for Control System in Safety-Critical Applications

Nobert

Alameh

et al. 2021

2021 IEEE International Symposium on Circuits and Systems (ISCAS)

View full text Add to dashboard Cite

show abstract

“…The rising need for electronic systems able to operate in harsh environments is fostering research towards electronics with reliable high-temperature operation [1], posing challenges which are being addressed at several levels: from innovative semiconductor device materials [2], to integrated circuit (IC) design techniques [3] and printed circuit board (PCB) level circuit assembly of packaged ICs [4].…”

Section: Introductionmentioning

confidence: 99%

“…Electronic components for commercial applications usually cannot operate at temperatures exceeding 100-150°C (Fig. 1) [4]. However, in automotive and aerospace applications, in power management systems, and in oil and gas extraction equipment, the temperature can rise well above 200°C [4], [5].…”

Section: Introductionmentioning

confidence: 99%

Design Criteria of High-Temperature Integrated Circuits Using Standard SOI CMOS Process up to 300°C

Sbrana,

Catania,

Paliy

et al. 2024

IEEE Access

View full text Add to dashboard Cite

In this paper, we discuss the challenges at the device and circuit level that must be addressed to design reliable silicon CMOS integrated circuits operating in high-temperature environments. We present experimental results on representative devices fabricated with a 180 nm CMOS SOI platform, which have been characterized up to 300°C, discuss issues arising at high temperature, and propose possible solutions. A BJT-based temperature sensor core is also described and evaluated across the same extended temperature range. We also propose and discuss design criteria optimized for a wide range of operating temperature. A sufficient on/off current ratio can be achieved by taking advantage of the isolation provided by low-leakage CMOS SOI process, while operation at low current density must be ensured to mitigate electromigration effects. Within these conditions, low-power precise sensing circuits can be effectively implemented with operating temperature up to 300°C, that are extremely relevant for industrial, mobility, and space applications.INDEX TERMS High temperature electronics; harsh environment electronics; CMOS SOI.

show abstract

“…Shrinkage, warpage, weight loss, and relatively low T g are some of the problems that high temperature may cause for such substrates. [7] These cause stresses on the conductors, components, and interconnects that are placed on the substrate, yielding to reduced electrical reliability and failure. [8][9][10][11] These problems and others often mean that these materials are not suitable for HTEs applications.…”

Section: Introductionmentioning

confidence: 99%

Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications

et al. 2023

View full text Add to dashboard Cite

There is a growing interest in the development of microelectronics that can perform reliably and robustly at temperatures above 300 °C. Such devices require stable thermal properties, low thermal drift, and thermal cycling resistance. Conventional hybrid circuit technology demonstrates high‐temperature packages, but the high costs and lead time are significant drawbacks. In contrast, additive manufacturing processes, including aerosol jet printing (AJP), offer cost and time benefits, as well as 3D structures and embedded features. However, the properties and reliability of additive packaging materials at extreme temperatures are not well known. Herein, the reliability at temperatures up to 750 °C in terms of electrical performance and mechanical strength of aerosol jet printed gold thick films onto ceramic substrates are assessed. Thermal coefficient of resistance of printed gold films is measured. The electrical resistance stability and leakage current of printed gold structures are also characterized during over 100 h of aging at temperatures up to 750 °C. Finally, the mechanical adhesion strength of the printed gold films is evaluated after aging for 100 h at temperatures up to 750 °C. The adhesion of the printed gold to the ceramic substrates remains high after aging, very stable resistances and minimal leakage currents have been observed.

show abstract

High temperature electronics packaging: An overview of substrates for high temperature

Cited by 7 publications

References 1 publication

Towards an LTCC SiP for Control System in Safety-Critical Applications

Towards an LTCC SiP for Control System in Safety-Critical Applications

Design Criteria of High-Temperature Integrated Circuits Using Standard SOI CMOS Process up to 300°C

Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications

Contact Info

Product

Resources

About