High thermal conductivity thermoplastic polyurethane/boron nitride/liquid metal composites: the role of the liquid bridge at the filler/filler interface

Ji, Zemin; Liu, Wenyi; Ouyang, Chenguang; Li, Yanbao

doi:10.1039/d1ma00637a

Cited by 15 publications

(2 citation statements)

References 56 publications

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“…Fig. 5 The referred specimens used as heat sink materials for the thermal management for LED chips (a) running temperature recording curves, (b) optical pictures and infrared images, (c) comparison between LEP/BN40LM20 and previously reported thermoconductive bulk polymer composites filled with both BN and LM, or filled with either of them, [48][49][50][51][52][53][54][55][56][57][58][59][60] (d) the closed-loop recycling of the prepared composites.…”

Section: Author Contributionsmentioning

confidence: 99%

Thermal conductivity and closed-loop recycling of bulk biphenyl epoxy composites with directional controllable thermal pathways

et al. 2023

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Section: Author Contributionsmentioning

confidence: 99%

Thermal conductivity and closed-loop recycling of bulk biphenyl epoxy composites with directional controllable thermal pathways

et al. 2023

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“…The rapid development of modern electronic devices toward high integration, high power density, and miniaturization presents an increasing requirement for heat dissipation, which makes it urgent to develop high thermally conductive materials for thermal management applications [ 1 , 2 , 3 , 4 ]. Currently, the most commonly used thermal management materials (TMMs) are mainly some types of thermosetting polymers, such as epoxy resin [ 5 ], organosilicone [ 6 ], polyurethane [ 7 , 8 ], etc. Among them, epoxy resin receives extensive research as a TMM, by virtue of its high adhesion strength, chemical durability, and excellent mechanical strength [ 9 , 10 , 11 ].…”

Section: Introductionmentioning

confidence: 99%

Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites

et al. 2023

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In this work, KH550 (γ-aminopropyl triethoxy silane)-modified hexagonal boron nitride (BN) nanofillers were synthesized through a one-step ball-milling route. Results show that the KH550-modified BN nanofillers synthesized by one-step ball-milling (BM@KH550-BN) exhibit excellent dispersion stability and a high yield of BN nanosheets. Using BM@KH550-BN as fillers for epoxy resin, the thermal conductivity of epoxy nanocomposites increased by 195.7% at 10 wt%, compared to neat epoxy resin. Simultaneously, the storage modulus and glass transition temperature (Tg) of the BM@KH550-BN/epoxy nanocomposite at 10 wt% also increased by 35.6% and 12.4 °C, respectively. The data calculated from the dynamical mechanical analysis show that the BM@KH550-BN nanofillers have a better filler effectiveness and a higher volume fraction of constrained region. The morphology of the fracture surface of the epoxy nanocomposites indicate that the BM@KH550-BN presents a uniform distribution in the epoxy matrix even at 10 wt%. This work guides the convenient preparation of high thermally conductive BN nanofillers, presenting a great application potential in the field of thermally conductive epoxy nanocomposites, which will promote the development of electronic packaging materials.

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Soft Elastic, Thermally Conductive, Electrically Insulating h‐BN@EGaIn/Ecoflex Composites as Encapsulation and Thermal Interface Materials Applicated in Wearable Electronics

Fu,

An,

Dong

et al. 2024

Adv Materials Technologies

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Thermal management is crucial in advanced wearable electronics, especially those with high integration and miniaturization, or incorporating self‐powered systems utilizing body heat. However, the low thermal conductivity of traditional silicone rubber encapsulation presents a major challenge to thermal management in wearable electronics. In this study, hexagonal boron nitride@Eutectic Gallium‐Indium/Ecoflex (h‐BN@EGaIn/Ecoflex) composites, a soft elastic material is developed that is thermally conductive yet electrically insulating, capable of serving as encapsulation and thermal interface materials in wearable devices. The key of successfully designing h‐BN@EGaIn/Ecoflex composites with such thermal, mechanical, and electrical properties is the anchoring of EGaIn on the h‐BN surface. Also, there exists a trade‐off in thermal‐electrical and thermal‐mechanical properties of the composites during the preparation of h‐BN@EGaIn hybrid fillers and their incorporation into the Ecoflex elastomer. In application demonstrations, through replacing the polydimethylsiloxane supporting layer with h‐BN@EGaIn/Ecoflex composites, a 20 K operation temperature decrease is observed in a wearable light‐emitting diode lamp. In addition, the output of a wearable thermoelectric generator encapsulated with h‐BN@EGaIn/Ecoflex composites increases by 100% compared to that encapsulated by Ecoflex. These results clearly show the benefits of substituting h‐BN@EGaIn/Ecoflex for silicon rubber encapsulation in wearable electronics.

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High thermal conductivity thermoplastic polyurethane/boron nitride/liquid metal composites: the role of the liquid bridge at the filler/filler interface

Abstract: Polymer composites with high thermal conductivity (TC) as electronic packaging materials play a critical role to dissipate heat in microelectronic devices. Among several methods to improve their TC, connection of...

Cited by 15 publications

References 56 publications

Thermal conductivity and closed-loop recycling of bulk biphenyl epoxy composites with directional controllable thermal pathways

Thermal conductivity and closed-loop recycling of bulk biphenyl epoxy composites with directional controllable thermal pathways

Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites

Soft Elastic, Thermally Conductive, Electrically Insulating h‐BN@EGaIn/Ecoflex Composites as Encapsulation and Thermal Interface Materials Applicated in Wearable Electronics

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