Snapshot
multispectral image (MSI) sensors have been proposed as
a key enabler for a plethora of multispectral imaging applications,
from diagnostic medical imaging to remote sensing. With each application
requiring a different set, and number, of spectral bands, the absence
of a scalable, cost-effective manufacturing solution for custom multispectral
filter arrays (MSFAs) has prevented widespread MSI adoption. Despite
recent nanophotonic-based efforts, such as plasmonic or high-index
metasurface arrays, large-area MSFA manufacturing still consists of
many-layer dielectric (Fabry–Perot) stacks, requiring separate
complex lithography steps for each spectral band and multiple material
compositions for each. It is an expensive, cumbersome, and inflexible
undertaking, but yields optimal optical performance. Here, we demonstrate
a manufacturing process that enables cost-effective wafer-level fabrication
of custom MSFAs in a single lithographic step, maintaining high efficiencies
(∼75%) and narrow line widths (∼25 nm) across the visible
to near-infrared. By merging grayscale (analog) lithography with metal–insulator–metal
(MIM) Fabry–Perot cavities, whereby exposure dose controls
cavity thickness, we demonstrate simplified fabrication of MSFAs up
to N-wavelength bands. The concept is first proven
using low-volume electron beam lithography, followed by the demonstration
of large-volume UV mask-based photolithography with MSFAs produced
at the wafer level. Our framework provides an attractive alternative
to conventional MSFA manufacture and metasurface-based spectral filters
by reducing both fabrication complexity and cost of these intricate
optical devices, while increasing customizability.