Highly Flexible Graphene Derivative Hybrid Film: An Outstanding Nonflammable Thermally Conductive yet Electrically Insulating Material for Efficient Thermal Management

Abstract

In modern society, advanced technology has facilitated the emergence of multifunctional appliances, particularly, portable electronic devices, which have been growing rapidly. Therefore, flexible thermally conductive materials with the combination of properties like outstanding thermal conductivity, excellent electrical insulation, mechanical flexibility, and strong flame retardancy, which could be used to efficiently dissipate heat generated from electronic components, are the demand of the day. In this study, graphite fluoride, a derivative of graphene, was exfoliated into graphene fluoride sheets (GFS) via the ball-milling process. Then, a suspension of graphene oxide (GO) and GFSs was vacuum-filtrated to obtain a mixed mass, and subsequently, the mixed mass was subjected to reduction under the action hydrogen iodide at low temperature to transform the GO to reduced graphene oxide (rGO). Finally, a highly flexible and thermally conductive 30-μm thick GFS@rGO hybrid film was prepared, which showed an exceptional in-plane thermal conductivity (212 W·m–1·K–1) and an excellent electrical insulating property (a volume resistivity of 1.1 × 1011 Ω·cm). The extraordinary in-plane thermal conductivity of the GFS@rGO hybrid films was attributed to the high intrinsic thermal conductivity of the filler components and the highly ordered filler alignment. Additionally, the GFS@rGO films showed a tolerance to bending cycles and high-temperature flame. The tensile strength and Young’s modulus of the GFS@rGO films increased with increasing the rGO content and reached a tensile strength of 69.3 MPa and a Young’s modulus of 10.2 GPa at 20 wt % rGO. An experiment of exposing the films to high-temperature flame demonstrated that the GFS@rGO films could efficiently prevent fire spreading. The microcombustion calorimetry results indicated that the GFS@rGO had significantly lower heat release rate (HRR) compared to the GO film. The peak HRR of GFS@rGO10 was only 21 W·g–1 at 323 °C, while that of GO was 198 W·g–1 at 159 °C.

Recent Advances in Fluorinated Graphene from Synthesis to Applications: Critical Review on Functional Chemistry and Structure Engineering

“…[32] However, many new advances have been realized during the latest 5 years. For example, some novel applications of FG have been reported in lubrication, [45][46][47][48][49][50] ice resistance, [44] thermally conductive yet electrically insulating materials, [51][52][53][54][55] biomedicine, [56][57][58][59][60][61][62] and batteries. [63][64][65][66][67][68][69][70][71] Apart from physical properties, chemical properties of FG have been thoroughly analyzed as one important direction in recent years.…”

“…[ 32 ] However, many new advances have been realized during the latest 5 years. For example, some novel applications of FG have been reported in lubrication, [ 45–50 ] ice resistance, [ 44 ] thermally conductive yet electrically insulating materials, [ 51–55 ] biomedicine, [ 56–62 ] and batteries. [ 63–71 ]…”

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

“…The heat dissipation becomes a main problem in many applications, such as integrated electronic devices, light emitting diodes (LEDs), and electronic packaging, [1][2][3] and an ideal TMM requires high-thermal conductivity, flexibility, low cost, and good processability. [4][5][6] In recent years, 3D printing as an additive manufacturing technology attracts wide attention because of its ability to fabricate complex parts using a computer-aided design without the need of conventional manufacturing technologies. 7 The fused-deposition modeling (FDM) approach has a potential to apply in real world owing to the speediness, low-cost, material variety, and high-dimensional accuracy.…”

“…The rapid development in electronic devices of small size and high speed processing requires high‐efficient thermal management materials (TMM), which facilitates the heat dissipation and relieves the thermal stress of component. The heat dissipation becomes a main problem in many applications, such as integrated electronic devices, light emitting diodes (LEDs), and electronic packaging, 1–3 and an ideal TMM requires high‐thermal conductivity, flexibility, low cost, and good processability 4–6 …”

Ultra‐Flexible, Dielectric, and Thermostable Boron Nitride‐Graphene Fluoride Hybrid Films for Efficient Thermal Management

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ultrathin, and highly thermal conductive films becomes the focus of solving the serious heat dissipation problem and improving the thermal management of flexible electronic devices. [7][8][9] Compared with isotropic conductive materials, papery films with anisotropic thermal conductivity (TC) and exceptional mechanical properties, which can dissipate heat from high-temperature areas in the in-plane direction while preventing adjacent components from being affected, are of great significance for the next-generation portable and foldable devices. [10][11][12] Many 2D nanomaterials such as graphene, [13] MXenes, [14] and black phosphorus [15] with highly anisotropic TC, have recently provided a new solution for the heat dissipation problem in devices.

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