Highly transparent flexible polydimethylsiloxane films – a promising candidate for optoelectronic devices

Abstract

In the present work, a siloxane based flexible substrate for optoelectronic applications with improved flexibility and high temperature withstanding capacity has been fabricated and the details are reported. The structural and optical properties of the substrate were characterized and the optical transparency is found to be about 90% − 95% in the visible region. The substrate withstands temperatures up to 300 °C without significant degradation and has a low thermal coefficient of expansion. Fourier transform infrared spectral data show the materials in the prepared substrate and SEM studies show the surface and cross‐sectional characteristics of the substrate. It has good mechanical strength, can withstand a high breaking load of 7 N, has a average tensile strength of 48.86 MPa and high average tensile modulus of 127.32 and also possesses excellent surface smoothness and resistance to both chemical and moisture with better rigidity; it will be a long lasting alternative for flexible plastic substrates. The optical characteristics such as refractive index (n) and extinction coefficient (k) are also reported. © 2016 Society of Chemical Industry

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