2015
DOI: 10.31399/asm.cp.istfa2015p0270
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How to Locate Resistance VIA by Analysing Schematic Combined with EMMI Result on Integrated Circuit Failed at Cold Temperature

Abstract: Due to the decreasing metal line size on complicated integrated circuit, non-destructive analysis strategy such as EMMI (Emission Microscope) is very significant to failure analysis, especially when special cold temperature failures are encountered. When combined with efficient schematic and layout analysis, the real defect can be localized without much microprobe work.

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Cited by 3 publications
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“…Therefore, there was more charge flow in the body substrate, which was more easily recombined with the majority carriers from the body of the MOSFET. The light emission intensity was strongly coupled to the amount of the recombination and thus the InGaAs photon emission method showed emission spot at the MOSFET area [15,16]. By layout analysis, the abnormal emission spot was possibly due to the incorrect pre-stage signal input for the MOSFET.…”
Section: Extra Ingaas Photon Emission Spotmentioning
confidence: 99%
“…Therefore, there was more charge flow in the body substrate, which was more easily recombined with the majority carriers from the body of the MOSFET. The light emission intensity was strongly coupled to the amount of the recombination and thus the InGaAs photon emission method showed emission spot at the MOSFET area [15,16]. By layout analysis, the abnormal emission spot was possibly due to the incorrect pre-stage signal input for the MOSFET.…”
Section: Extra Ingaas Photon Emission Spotmentioning
confidence: 99%