IEEE Nuclear Science Symposium Conference Record, 2005
DOI: 10.1109/nssmic.2005.1596579
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Hydrogenated Amorphous Silicon Sensors Based on Thin Film on ASIC Technology

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Cited by 6 publications
(5 citation statements)
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“…The a-Si:H pin diode has been fabricated on top of an ASIC as the photo sensor. 88) However, the split-gate a-Si:H TFT can also be used as a photo sensor, which does not require the low dopant efficiency p þ thin film deposition step. 75) In addition, special materials or structures of the a-Si:H TFT can be used to detect other environmental parameters, such as the pH value in a solution or the components in a gas stream.…”
Section: Future Applications and Collaborationsmentioning
confidence: 99%
“…The a-Si:H pin diode has been fabricated on top of an ASIC as the photo sensor. 88) However, the split-gate a-Si:H TFT can also be used as a photo sensor, which does not require the low dopant efficiency p þ thin film deposition step. 75) In addition, special materials or structures of the a-Si:H TFT can be used to detect other environmental parameters, such as the pH value in a solution or the components in a gas stream.…”
Section: Future Applications and Collaborationsmentioning
confidence: 99%
“…The thin-film hydrogenated amorphous silicon (a-Si:H) technology [3] allows the custom fit of amorphous silicon photodiode arrays to the geometry of the flow microfluidic channel. The low-temperature (below 200°C) technology plasma-enhanced chemical-vapor deposition (PECVD) [2] or hot wire chemical-vapor deposition (HWCVD) [4] allows deposition of amorphous layers on the glass and polymer substrates, respectively, and on top of crystalline silicon integrated circuits without any damage to the circuits below [5]. At appropriate RF power, gas flows, chamber pressure, and substrate temperature in PECVD, hydrogen atoms are introduced into the thin film to passivate the silicon dangling bonds (DBs) and remove a part of (metastable) defect states from the forbidden band gap.…”
Section: Introductionmentioning
confidence: 99%
“…The development of a photo-detection system being compatible with various MEMS technologies would form an ideal platform for the fabrication of integrated measurement systems for many different applications. Current approaches in the field of opto-electronic sensors tend to miniaturize the imaging system by using small-pixel CMOS/CCD detectors [2], micro-PD/LED arrays [3] or thin film on ASIC (TFA) technology based on the deposition of a photo-sensitive layer on top of a read out integrated circuit [4], [5].…”
Section: Introductionmentioning
confidence: 99%