Hydrolysis and condensation of a benzocyclobutene-functionalized precursor for the synthesis of high performance low-K polymers

Abstract

A new synthetic route involving the hydrolysis and condensation of a BCB precursor for high performance low-K benzocyclobutene-functionalized polymers was developed.

Preparation of planar and hydrophobic benzocyclobutene‐based dielectric material from biorenewable rosin

“…The difference between the maximum and minimum thickness is 3.1 nm. Moreover, the measurements show that the average surface roughness (Ra) of the cured resin is 0.337 nm within a 5.0 × 5.0 μm 2 area, and the Ra value of cured resin could be comparable to the reported BCB resins, such as fluorinated BCB resins, siloxane‐based BCB resins, and BCB resins containing bulk groups . It is well known that the BCB‐based resin exhibits good surface roughness, and the introduction of rosin did not affect the surface smoothness of the resin.…”

“…With the development of microelectronics, the sizes of individual devices have become progressively smaller. Scaling down generates problems such as interconnect signal delay (RC delay) that gives rise to propagation delay, crosstalk noise, and power dissipation . These problems have become an obstacle to further development within the microelectronics.…”

“…The use of interconnect materials with low dielectric constant is one effective way to reduce RC delay . Therefore, the development of materials with low dielectric constant has received widespread attention . One method for decreasing the dielectric constant is to prepare porous materials because the dielectric constant of air is approximately 1.…”

“…One method for decreasing the dielectric constant is to prepare porous materials because the dielectric constant of air is approximately 1. However, high porosity will decrease the mechanical strength and increase water absorption, thus increasing the dielectric constant . Additionally, Long et al .…”

Materials containing benzocyclobutene units with low dielectric constant and good thermostability prepared from star‐shaped molecules

“…Compared with other polymers, BCB resins possess lower dielectric constant and dissipation factors. Therefore, they have become one of the best candidates for high‐performance media in ULSI manufacturing . Over the past few decades, a series of BCB resins with low dielectric constant and high thermal stability have been designed.…”