Hydrostatic pressure induced ductility transitions in pure bismuth and tin-bismuth alloys

Dembowski, Peter V.; Pepe, Joseph; Davidson, Thomas

doi:10.1016/0001-6160(74)90067-4

Cited by 4 publications

(1 citation statement)

References 7 publications

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“…The mechanical behaviour of various compositions of Sn-Bi alloys has also been observed over a range of superimposed hydrostatic pressures [6]. The creep of low melting point solder joints and the ternary Pb-Bi-Sn alloy had been studied in [7, 81.…”

Section: Mechanical Tests Have Been Performed Onmentioning

confidence: 99%

Effect of Phase Transformation on Creep Characteristics of Sn—5 wt% Bi Alloy

Al-Ganainy

Khalifa

Afify

et al. 1996

Phys. Stat. Sol. (a)

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The creep characteristics of Sn—5 wt% Bi alloy have been investigated under different constant applied stresses ranging from 26.8 to 29.4 MPa and at different temperatures ranging from 305 to 373 K. Results of both transient and steady state creep indicated one transition point at 328 K. The transient creep parameters β and n were calculated and found to change with the applied stresses from 1.8 × 10−6 to 6.36 × 10−5 and from 0.53 to 0.98, respectively. The strain rate sensitivity parameter (m) was found to change from 0.071 to 0.093 which characterizes a dislocation mechanism. The activation energy of the transient creep amounted to 17 and 33 kJ/mol before and after the transformation temperature, due to both glide of dislocations and cross slipping dislocation mechanism, respectively. The activation energies of the steady state creep in the vicinity of the transformation and above the transformation temperature were found to be 62 and 87 kJ/mol as characteristic of the grain boundary sliding mechanism. The analysis of the X‐ray diffraction patterns of the alloy samples confirmed all the above‐mentioned mechanisms.

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Section: Mechanical Tests Have Been Performed Onmentioning

confidence: 99%