2021
DOI: 10.1109/tie.2020.3022526
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In Situ Insulated Gate Bipolar Transistor Junction Temperature Estimation Method via a Bond Wire Degradation Independent Parameter Turn-OFF V ce Overshoot

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Cited by 35 publications
(5 citation statements)
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“…The result shows that this method is superior to a single SVM model. However, the original MPA is still prone to fall into local optimization and low global search accuracy [34]. Jia et al [35] proposed that introduce the coevolutionary culture mechanism into the MPA to improve the performance of the original algorithm and have a higher probability of avoiding local optimization.…”
Section: Literature Reviewmentioning
confidence: 99%
“…The result shows that this method is superior to a single SVM model. However, the original MPA is still prone to fall into local optimization and low global search accuracy [34]. Jia et al [35] proposed that introduce the coevolutionary culture mechanism into the MPA to improve the performance of the original algorithm and have a higher probability of avoiding local optimization.…”
Section: Literature Reviewmentioning
confidence: 99%
“…These are caused by the thermo-mechanical stress induced by the temperature gradients between the components due to the different materials and power losses [34]. In this context, research is focused on online junction temperature estimation methods, so to optimize the power module operation to enhance its reliability [58].…”
Section: B Semiconductor Lifetimementioning
confidence: 99%
“…For example, the heat flux density of GaN HEMT is as high as 300 W/cm 2 , about three times that of Si-based IGBTs, as shown in Figure 1 [6]. Since a high heat flux density causes the devices' junction temperature to increase, the junction temperature as a key reliability parameter for Si-based devices is also valuable for the reliability of GaN HEMT [7][8][9].…”
Section: Introductionmentioning
confidence: 99%