2020
DOI: 10.1109/ted.2020.3012123
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J SWof 5.5 MA/cm2 and RA of 5.2-Ω · μm2 STT-MRAM Technology for LLC Application

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Cited by 13 publications
(17 citation statements)
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“…Larger on-chip buffer memory is needed to minimize DRAM accesses, and it can improve the energy efficiency and speed of the accelerator. However, conventional Static Random-Access Memory (SRAM) based solutions suffer from area constraints and leakage power at advanced technology nodes [6], [7], which is a major concern for the energyconstraint IoT domain. STT-MRAM has the potential to replace SRAM as the global buffer in high-performance AI accelerators that require large on-chip memory [3], [8].…”
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confidence: 99%
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“…Larger on-chip buffer memory is needed to minimize DRAM accesses, and it can improve the energy efficiency and speed of the accelerator. However, conventional Static Random-Access Memory (SRAM) based solutions suffer from area constraints and leakage power at advanced technology nodes [6], [7], which is a major concern for the energyconstraint IoT domain. STT-MRAM has the potential to replace SRAM as the global buffer in high-performance AI accelerators that require large on-chip memory [3], [8].…”
mentioning
confidence: 99%
“…The emerging resistive RAM (RRAM) and Phase Change (PCM) based cross-point memory suffers from endurance, reliability and variability problems [7], [11]. Among all the emerging embedded memory technologies, STT-MRAM is one of the most promising due to its high energy efficiency, write endurance (e.g., more than 1 million cycles), high cell density, high-temperature data retention capability, operating voltage comparable with CMOS logic, and immunity to soft errors [6], [7], [12]- [16]. Moreover, STT-MRAM is higly compatible with CMOS and requires only 2 to 6 extra masks in the backend-of-the-line (BEOL) process [6], [13].…”
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confidence: 99%
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