N-Phenyl-substituted poly(benzimidazole imide)s with high glass transition temperature and low coefficient of thermal expansion

Abstract

N-PhPABZ successfully cured the brittleness of PMDA-based poly(benzimidazole imide)s. N-PhPABZ-PMDA film illustrated an extremely high Tg of 486 °C and a low CTE of 9.7 ppm K−1.

High strength, stable and self-healing copolyimide for defects induced by mechanical and electrical damages

“…Moreover, the easily rotating molecular chain will cause the decrease of T g . 28,29 However, it can be seen from Fig. S5c (ESI†) that the mechanical properties of the CPI film are improved with the increase of BAPB ratio.…”

Polyimides with super‐highTgand ultra‐low coefficient of thermal expansion fromN‐substituted bibenzimidazole diamines

“…In addition to the strengthened intermolecular interactions, the steric hindrance of rigid side groups plays a crucial role in improving the heat resistance of polymers 34,35 . In this system, the bulky N ‐phenyl hinders the rotational freedom around their backbone when the PI experiences high temperature 22 . Thus, the poly(benzimidazole imide) derived from PhDABZ reveals a growth in T g of ~17 °C for MeDABZ‐PMDA.…”

“…34,35 In this system, T A B L E 1 Basic properties of the poly(benzimidazole imide) films the bulky N-phenyl hinders the rotational freedom around their backbone when the PI experiences high temperature. 22 Thus, the poly(benzimidazole imide) derived from PhDABZ reveals a growth in T g of $17 C for MeDABZ-PMDA.…”

“…Based on the theory, the PI derived from 5(6)‐amino‐2‐(4‐aminobenzene)benzimidazole (PABZ) and PMDA probably has the highest heat‐resistance grade, whereas it is too brittle to be film 20,21 . In our previous study, we solve the film‐forming problem by introducing an N ‐substituent in the PMDA‐based poly(benzimidazole imide)s (PBIIs), nevertheless, the thermal properties of these obtained PIs need to be further improved 21,22 …”

“…20,21 In our previous study, we solve the film-forming problem by introducing an N-substituent in the PMDAbased poly(benzimidazole imide)s (PBIIs), nevertheless, the thermal properties of these obtained PIs need to be further improved. 21,22 In this work, a novel bibenzimidazole diamine and two PMDA-based poly(benzimidazole imide)s had been successfully synthesized (Schemes 1 and 2). The bibenzimidazole containing N-substituent provides more chances for hydrogen-bond formation, higher electron-donating ability and better film-forming capability, which is expected to develop PIs with improved thermal performance.…”