W ‐band quasi‐elliptical waveguide filter with cross‐coupling and source–load coupling

Abstract

A high-performance waveguide bandpass filter operating at W-band is presented. This folded fourth-order filter with quasi-elliptic response is developed by introducing cross-coupling and source-load coupling, while maintaining a compact construction for simple computer numerical control (CNC) milling process. The filter fabricated within aluminium block shows an insertion loss of about 1.2 dB in a 3 dB fractional bandwidth of 5.5% from 90.1 to 95.2 GHz, which are very close to the simulated results in the full W-band.

W‐band dual‐band waveguide band‐pass filter using dual‐mode cavities

“…Introduction: As the millimetre-wave wireless communication systems used for imaging radar, remote sensor and radio-astronomy have been developed rapidly, the interest in the essential W-band filters has been increased [1][2][3][4][5][6][7][8]. With the merits of low-loss, high-power handling and easy interconnection, rectangular waveguides are still the principal medium at such high-frequency band.…”

“…With the merits of low-loss, high-power handling and easy interconnection, rectangular waveguides are still the principal medium at such high-frequency band. Lots of W-band waveguide band-pass filters (BPFs) have been developed by various processes such as thick SU-8 photoresist technology [1,2], deep reactive ion etching (DRIE) process [3], computer numerical control (CNC) milling [4], laser micromachining and 3D printing [5]. However, the waveguide filters fabricated by the CNC-milling technology have exhibited the superior performance of low insertion loss and easy to be assembled with the system.…”

Compact balanced bandpass filter with the fractal defected structures

“…In order to obtain a sharp cutoff skirt under DM operation, two TZs should be introduced on both sides of the passband. The most effective way to generate TZ is cross-coupling technology [10]. Because of the extra two open sides for the novel QMSIWR, this resonator has more flexibilities to implement diverse coupling topology structures.…”

Effect of Grain Size on Formability and Deformation Mechanism of High‐Purity Aluminum during Micro‐Embossing Process at Elevated Temperature

“…Nevertheless, as to MEMS components of micrometer scale for metal, fabrication process was still a great challenge. The conventional methods included lithography, micro‐electro‐discharge machining, and micromilling . However, growing concerns on the energy and environment issues inspired us to develop an appropriate fabrication method which is environmental friendly …”