“…Oxide precipitates in RTA wafers are normally produced by two-step annealing, 800 + 1000 o C. The density profile N(z) mimics [2,14] the RTAinstalled and Pt-monitored profile of slow vacancies C s (z), according to a cubic dependence: N ~ C s 3 . The density profiles of a good depth resolution have been reported [17] for several T RTA (1280, 1260 and 1240 o C, in Ar or N 2 ambient) and for several cooling rates q (70, 50 and 25 K/s) used after holding at T RTA .…”