Impact of De-molding Force on Exposure Dosage in UV-Nanoimprint Process

Abstract

Mold releasing forces are experimentally measured in various exposure dosages for UV nanoimprint resist. PAK01 resist is examined to evaluate the chemical conversion by FTIR. Time dependent conversion ratio is measured under UV exposure and the conversion ratio of the UV resin versus exposed dosages is verified. Also, releasing forces for various exposure dosages are mechanically measured for flat mold. The results show the measured releasing force is not stabilized until the conversion is completed up to over around 90 %. Based on these results, the minimums exposure dosage is known for successful releasing.

UV-Nanoimprint Lithography (NIL) Process Simulation

“…As the exposure time proceeds, the storage modulus G of the resist increases by conversion of the photo reactive group and the resist thickness decreases due to resist curing. They strongly depend on UV intensity but not dosage like conventional photo resists [11][12][13][14]. …”

Study on Curing Characteristic of UV Nanoimprint Resist

“…The UV resist is demanded high speed curing, lower shrinkage, sufficient rigidness and low adhesion property after UV curing. Evaluation and understanding of UV curing characteristics are indispensable for process design for UV-NIL and material optimizations [8][9][10][11][12][13][14]. We had been reported curing properties on typical resist and proposed physical modeling for process simulation in UV-NIL [15].…”

Evaluation of Curing Characteristics in UV-NIL Resist

“…In this paper, PAK-01 and C-TGC-02 (TOYO GOSEI) resist are investigated; where PAK-01 is widely used in UV nanoimprint process [2][3][4] and C-TGC-02 is examinational resist for researches usages and its chemical components are released.…”