2000
DOI: 10.1109/4.859508
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Impact of extrinsic and intrinsic parameter fluctuations on CMOS circuit performance

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Cited by 70 publications
(38 citation statements)
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“…In this section, we use the template attacks introduced in [3], which are the most generic solution for this purpose 1 . Template attacks essentially work in two steps.…”
Section: Worst Case Scenario: Profiling and Attacking The Same Chipmentioning
confidence: 99%
See 1 more Smart Citation
“…In this section, we use the template attacks introduced in [3], which are the most generic solution for this purpose 1 . Template attacks essentially work in two steps.…”
Section: Worst Case Scenario: Profiling and Attacking The Same Chipmentioning
confidence: 99%
“…Second, device variability becomes important (i.e. it becomes increasingly difficult to engineer identical chips) [1,17]. As a consequence, the goal of this paper is to investigate the impact of these effects, with a focus on power variability, from the point of view of sidechannel attacks.…”
Section: Introductionmentioning
confidence: 99%
“…The effects of WID variations are becoming more and more prominent with scaling and they have a direct influence on local gate delay variations. Numerous random factors such as statistical deviations of the doping concentration and imprecision of lithography lead to more pronounced delay variations for minimum transistor sizes [13,14]. These factors are intrinsic since they cannot be eliminated by external control of conventional manufacturing.…”
Section: Minimizing Local Delay Variations For Nanoscale Cmos Technolmentioning
confidence: 99%
“…A large chip, however, contains many critical paths, all of which must satisfy the worst-case delay constraint [13][14][15][16]27]. For completely dependent paths (path delay correlation equal to 1), the PDF given in (3.11) is valid for all the paths to model the worst-case delay.…”
Section: Impact Of Within-die Variations On the Maximum Critical Pathmentioning
confidence: 99%
“…With the progressive scaling of conventional MOSFETs to nanometre dimensions, variations in transistor characteristics due to random discrete dopants, interface roughness and line edge roughness start to adversely affect the yield and functionality of circuits constructed from them [1,2]. Due to the scaling limitations of the conventional MOSFETs, novel device architectures, such as UTB-SOI and multi-gate MOSFETs, that are also more resistant to some of the sources of intrinsic parameter fluctuations, are anticipated to play an increasingly important role before the end of the current ITRS [3] roadmap.…”
Section: Introductionmentioning
confidence: 99%