2020
DOI: 10.1109/jphot.2020.2996808
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Impact of Temperature and Doping on the Performance of ${{\bf Ge}}/{{\bf G}}{{{\bf e}}_{1 - {\boldsymbol{x}}}}{{\bf S}}{{{\bf n}}_{\boldsymbol{x}}}/{{\bf Ge}}$ Heterojunction Phototransistors

Abstract: We study the effect of temperature and doping in Si-based GeSn heterojunction phototransistors (HPTs) for low-power-consuming, low-cost, and high-speed mid-infrared (MIR) applications. The incorporation of Ge 1−x Sn x alloy in the base of our HPTs significantly shortens the emitter-to-collector transit time, leading to high cutoff frequency (f T) due to an increase in mobility. Furthermore, the Ge 1−x Sn x base extends the optical detection over a wide range (up to 2500 nm) due to the shrinkage of the bandgap … Show more

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Cited by 6 publications
(5 citation statements)
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“…Figure 1 depicts the 3D schematic of Ge 1−x Sn x /Si 1−y−z Ge y Sn z heterostructure laser wrapped with Si 3 N 4 stress liner grown on a Ge/SOI (Silicon On Insulator) substrate through a Ge 1−t Sn t buffer [31]. In order to achieve a fully relaxed lattice-matched Ge 1−x Sn x /Si 1−y−z Ge y Sn z heterostructure, t > x and the thickness of Ge 1−t Sn t higher than a critical value were used to counteract the compressive strain and line defects introduced by the Ge substrate, respectively.…”
Section: Device Structurementioning
confidence: 99%
“…Figure 1 depicts the 3D schematic of Ge 1−x Sn x /Si 1−y−z Ge y Sn z heterostructure laser wrapped with Si 3 N 4 stress liner grown on a Ge/SOI (Silicon On Insulator) substrate through a Ge 1−t Sn t buffer [31]. In order to achieve a fully relaxed lattice-matched Ge 1−x Sn x /Si 1−y−z Ge y Sn z heterostructure, t > x and the thickness of Ge 1−t Sn t higher than a critical value were used to counteract the compressive strain and line defects introduced by the Ge substrate, respectively.…”
Section: Device Structurementioning
confidence: 99%
“…Then, the active layer is etched into a cylinder with an outer diameter of 3μm. Finally, the metal electrodes are prepared by metal contact deposition with a lift-off process [32,33]. Tb0.3Dy0.7Fe1.95 belongs to the ternary Laves phase with lower magneto crystalline anisotropy and higher magnetostriction coefficient (λ) which can be used as the adjustable stressor [34][35][36].…”
Section: Design Of Device Structurementioning
confidence: 99%
“…In the absence of external stress, the magnetostriction coefficient (λ) will increase accordingly by adjusting the strength of the external magnetic field (H) until saturation, up to 1200 ppm [14]. The Si0.1Ge0.78Sn0.12/Ge0.90Sn0.10/Si0.012Ge0.848Sn0.14 is etched with an outer length of 6μm, and the metal electrodes are deposited on the surface by metal contact deposition [15]. An adjustable strain in the range of 0-0.11% can be obtained by adjusting the magnetic field strength as shown in Fig 3.…”
Section: Device Structurementioning
confidence: 99%