Impression creep of Sn–40Pb–2·5Sb peritectic solder alloy

Rezaee-Bazzaz, A.; Mahmudi, R.

doi:10.1179/174328405x46079

Cited by 23 publications

(9 citation statements)

References 25 publications

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“…This method can be particularly advantageous when the material is only available as small test pieces or there are difficulties with the machining of samples made of very soft materials such as solder alloys. [17][18][19] Impression creep involves the time-dependent penetration of a cylindrical punch with a flat end into the material under constant load and temperature. 20 During the test, the variation in penetration depth of the impresser with time is continuously recorded, and thus the penetration rate or impression velocity can be obtained.…”

Section: Introductionmentioning

confidence: 99%

Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles

Kangooie

Mahmudi

Geranmayeh

2009

Journal of Elec Materi

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In the present study, the Sn-1.7Sb-1.5Ag solder alloy and the same material reinforced with 5 vol.% of 0.3-lm Al 2 O 3 particles were synthesized using the powder metallurgy route of blending, compaction, sintering, and extrusion. The impression creep behavior of both monolithic and composite solders was studied under a constant punching stress in the range of 20 MPa to 110 MPa, at temperatures in the range of 320 K to 430 K. The creep resistance of the composite solder was higher than that of the monolithic alloy at all applied stresses and temperatures, as indicated by their corresponding minimum creep rates. This was attributed to the dispersive distribution of the submicron-sized Al 2 O 3 particles in the composite solder. Assuming a power-law relationship between the impression stress and velocity, average stress exponents of 5.3 to 5.6 and 5.8 to 5.9 were obtained for the monolithic and composite materials, respectively. Analysis of the data showed that, for all loads and temperatures, the activation energy for both materials was almost stress independent, with average values of 44.0 kJ mol À1 and 41.6 kJ mol À1 for the monolithic and composite solders, respectively. These activation energies are close to the value of 46 kJ mol À1 for dislocation climb, assisted by vacancy diffusion through dislocation cores in the Sn. This, together with the stress exponents of about 5 to 5.9, suggests that the operative creep mechanism is dislocation viscous glide controlled by dislocation pipe diffusion.

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Section: Introductionmentioning

confidence: 99%

Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles

Kangooie

Mahmudi

Geranmayeh

2009

Journal of Elec Materi

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“…This has been achieved using the impression creep testing technique, which has been widely used in the creep study of various solder materials. [17][18][19][20][21] EXPERIMENTAL PROCEDURE…”

Section: Introductionmentioning

confidence: 99%

Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy

Mahmudi

Geranmayeh

Noori

et al. 2008

Journal of Elec Materi

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Creep behavior of the eutectic Sn-9Zn, Sn-9Zn-0.5Ag, and Sn-9Zn-0.5Al solder alloys was studied by impression testing under constant punching stress in the range of 60 MPa to 130 MPa and at temperatures in the range of 298 K to 370 K. Analysis of the data showed that, for all loads and temperatures, Sn-9Zn-0.5Al had the lowest creep rates and thus the highest creep resistance among all materials tested. The creep resistance of Sn-9Zn-0.5Ag was slightly lower than that of the Al-containing alloy. The enhanced creep behaviors of the ternary alloys are attributed to the presence of AgZn 3 and very fine Zn particles, which act as the main strengthening agents in the Sn-9Zn-0.5Ag and Sn-9Zn-0.5Al alloys, respectively. Assuming a power-law relationship between the impression rate and stress, average stress exponents of 6.9, 7.1, and 7.2 and activation energies of 42.1 kJ mol -1 , 42.9 kJ mol -1 , and 43.0 kJ mol -1 were obtained for Sn-9Zn, Sn-9Zn-0.5Ag and Sn-9Zn-0.5Al, respectively. These activation energies are close to 46 kJ mol -1 for dislocation climb, assisted by vacancy diffusion through dislocation cores in the Sn. This, together with the stress exponents of about 7, suggests that the operative creep mechanism is dislocation climb controlled by dislocation pipe diffusion.

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“…Creep characteristics of solder alloys have been widely investigated by indentation [5][6][7][8][9], impression [10][11][12][13][14] and most frequently by conventional creep testing methods [4,[15][16][17]. The stress relaxation tests, however, are applied mainly to the creep studies of polymers and in few cases to metals and alloys [18,19].…”

Section: Introductionmentioning

confidence: 99%

Investigation of stress exponent in the room-temperature creep of Sn–40Pb–2.5Sb solder alloy

Mahmudi

Rezaee-Bazzaz

Banaie-Fard

2007

Journal of Alloys and Compounds

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Impression creep of Sn–40Pb–2·5Sb peritectic solder alloy

Cited by 23 publications

References 25 publications

Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles

Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles

Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy

Investigation of stress exponent in the room-temperature creep of Sn–40Pb–2.5Sb solder alloy

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