2014
DOI: 10.1149/2.0041407jss
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Improved Cleaning Process for Textured ∼25 μm Flexible Mono-Crystalline Silicon Heterojunction Solar Cells with Metal Backing

Abstract: An improved cleaning process is developed to remove front surface contamination for single heterojunction solar cells on textured surfaces on ∼25 μm thick exfoliated, flexible mono-crystalline silicon. The process is very effective in cleaning metallic and organic residues, without introducing additional contamination or degrading the supporting back metal used for ultrathin substrate handling. Quantitative analysis of the Auger electron spectra shows significant potassium contamination reduction (∼0.89% atomi… Show more

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Cited by 4 publications
(1 citation statement)
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“…[1][2][3][4][5][6][7][8] Traditionally, the crystalline silicon (c-Si) material is the first candidate to fabricate high-quality photovoltaics, [9,10] DOI: 10.1002/adom.202302121 but the c-Si wafer is rigid, bulky, and hard, making it face a dilemma when used for flexible applications. To afford such flexible application demand, a rather complicated and expensive fabrication process is needed, such as chemical etching or exfoliation to prepare ultra-thin monocrystalline silicon wafers (thickness <40 μm), [11][12][13][14] or using the top-down method to fabricate vertical micro/nanowire that then transferred onto/into organic substrate/encapsulation, [15][16][17] or designing serpentine/grid nanowire (by using high-accuracy photolithography or electron beam lithography), [18] or fabricating organic-inorganic hybrid devices, for example using poly (3,4ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) as a p-type window. [19,20] Therefore, the thin films prepared on flexible substrates can have reasonable mechanical properties, which may be a better/simpler choice for fabricating mechanically stable flexible photovoltaics/photodetectors.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8] Traditionally, the crystalline silicon (c-Si) material is the first candidate to fabricate high-quality photovoltaics, [9,10] DOI: 10.1002/adom.202302121 but the c-Si wafer is rigid, bulky, and hard, making it face a dilemma when used for flexible applications. To afford such flexible application demand, a rather complicated and expensive fabrication process is needed, such as chemical etching or exfoliation to prepare ultra-thin monocrystalline silicon wafers (thickness <40 μm), [11][12][13][14] or using the top-down method to fabricate vertical micro/nanowire that then transferred onto/into organic substrate/encapsulation, [15][16][17] or designing serpentine/grid nanowire (by using high-accuracy photolithography or electron beam lithography), [18] or fabricating organic-inorganic hybrid devices, for example using poly (3,4ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) as a p-type window. [19,20] Therefore, the thin films prepared on flexible substrates can have reasonable mechanical properties, which may be a better/simpler choice for fabricating mechanically stable flexible photovoltaics/photodetectors.…”
Section: Introductionmentioning
confidence: 99%