Improved drop reliability of Sn–Ag–Cu solder joints by Zn addition to a Cu wetting layer

Park, Jae Yong; Kim, Young Min

doi:10.1007/s10854-015-3153-6

J Mater Sci: Mater Electron

2015

DOI: 10.1007/s10854-015-3153-6

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Improved drop reliability of Sn–Ag–Cu solder joints by Zn addition to a Cu wetting layer

Jae Yong Park

Young Min Kim

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Cited by 8 publications

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Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system

Wang

et al. 2016

J Mater Sci: Mater Electron

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Improved drop reliability of Sn–Ag–Cu solder joints by Zn addition to a Cu wetting layer

Cited by 8 publications

References 36 publications

Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system

Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system

Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints

Assessment of internal exposure risk from metals pollution of occupational and non-occupational populations around a non-ferrous metal smelting plant

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