The important issue of selection of gate dielectrics to reduce short channel effects (SCEs) is presented along with the study of different channel materials in transistors. A comparative study of performance was carried out of silicon dioxide (SiO 2), aluminium oxide (Al 2 O 3), hafnium oxide (HfO 2), lanthanum oxide (La 2 O 3) and titanium dioxide (TiO 2) as gate dielectrics for Si double gate field-effect transistor (FET), Si gate all around (GAA) nanowire FET (NWFET), indium arsenide GAA NWFET and carbon nanotube (CNT) FETs within nonequilibrium Green's function formalism. Simulated results show that TiO 2 is better gate dielectric as compared with SiO 2 , Al 2 O 3 , HfO 2 and La 2 O 3 , with near ideal subthreshold swing (60 mV/decade), lower I off , improved drain-induced barrier lowering and high transconductance (g m). Also, the gate capacitance (C g), cutoff frequency (f T) and switching time (t) improve with the high-k dielectric materials. Furthermore, the study of different channel material shows that CNT has better SCEs, smaller C g with t ranging from 13.5 to 12.5 fs suitable for digital applications and f T of about 7-9 THz.