Improved Reliability and Mechanical Performance of Sn58Bi Solder Alloys

Ren, Guang; Collins, Maurice N.

doi:10.20944/preprints201904.0136.v1

2019

DOI: 10.20944/preprints201904.0136.v1

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Improved Reliability and Mechanical Performance of Sn58Bi Solder Alloys

Guang Ren¹,

Maurice N. Collins²

Abstract: Microstructural and mechanical properties of the eutectic Sn58Bi and micro-alloyed Sn57.6Bi0.4Ag solder alloys were compared. With the addition of Ag micro-alloy, the tensile strength was improved and this is attributed to a combination of microstructure refinement and an Ag3Sn precipitation hardening mechanism. However, ductility is slightly deteriorated due to the brittle nature of the Ag3Sn intermetallic compounds (IMCs). Additionally, a board level reliability study of Ag micro-alloyed Sn58Bi solder joints… Show more

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Cited by 4 publications

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Microstructural Evolution and Tensile Testing of a Bi–Sn (57/43) Alloy Processed by Tube High-Pressure Shearing

Wang

et al. 2021

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Tube high-pressure shearing (t-HPS) processing was performed on a eutectic Bi–Sn (57/43) alloy for 0.25, 1, 5 and 20 turns. The selected samples were stored at room temperature for up to 56 days to examine the strain weakening and self-annealing behavior of the alloy. The results showed that t-HPS processing gradually refined the microstructure and led to decreasing of microhardness, but microhardness increased slowly during the subsequent storage at room temperature. Shear localization of the eutectic structure during t-HPS processing was observed as large amounts of narrow dense lamellar zones were visible in the deformed microstructures. The Bi–Sn (57/43) alloy processed by t-HPS exhibited significantly enhanced superplastic properties with elongations up to >1800% in a sample after t-HPS processing for 20 turns. This high elongation is attributed to the breaking of the lamellar structure and the very small grain size.

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Microstructural Evolution and Tensile Testing of a Bi–Sn (57/43) Alloy Processed by Tube High-Pressure Shearing

Wang

et al. 2021

Crystals

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Analysis of Sn-Bi Solders: X-ray Micro Computed Tomography Imaging and Microstructure Characterization in Relation to Properties and Liquid Phase Healing Potential

et al. 2020

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This work provides an analysis of X-ray micro computed tomography data of Sn-xBi solders with x = 20, 30, 35, 47, 58 wt.% Bi. The eutectic thickness, fraction of eutectic and primary phase are analyzed. Furthermore, the 3D data is evaluated by means of morphology parameters, such as, shape complexity, flatness, elongation and mean intercept length tensor. The investigated alloys are categorized in three groups based on their morphology, which are described as “complex dominant”, “complex- equiaxed” and “mixed”. The mechanical behavior of Sn-Bi alloys in the semi-solid configuration and the correlation with microstructural parameters are discussed. A varying degree of geometric anisotropy of the investigated alloys is found through the mean intercept length tensor. Representative volume element models for finite element simulations (RVE-FEM) are created from tomography data of each alloy to analyze a correlation of geometric and elastic anisotropy. The simulations reveal an elastic isotropic behavior due to the small difference of elastic constants of primary and eutectic phase. A discussion of properties in the semi-solid state and liquid phase healing is provided.

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Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

2022

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Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG) surface finishes. We investigated formation of intermetallic compounds (IMCs) and their diffusion barrier properties at reaction interfaces as functions of Pt NP content in the composite solders and duration of solid-state aging at 100 °C. At Sn-58Bi-xPt/ENIG interfaces, typical Ni3Sn4/Ni3P(P-rich layer) microstructure was formed. With the large consumption of the Ni-P layer, the Ni-P and Cu layers were intermixed and Cu atoms spread over the composite solder after 500 h of aging. By contrast, a (Pd,Ni)Sn4/thin Ni3Sn4 microstructure was observed at the Sn-58Bi-xPt/ENEPIG interfaces. The (Pd,Ni)Sn4 IMC effectively suppressed the consumption of the Ni-P layer and Ni3Sn4 growth, functioning as a good diffusion barrier. Therefore, the Sn-58Bi-xPt/ENEPIG joint survived 500 h of aging without microstructural degradation. Based on the experimental results and analysis of this study, Sn-58Bi-0.05Pt/ENEPIG is suggested as the optimum combination for future low-temperature soldering systems.

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Improved Reliability and Mechanical Performance of Sn58Bi Solder Alloys

Cited by 4 publications

References 30 publications

Microstructural Evolution and Tensile Testing of a Bi–Sn (57/43) Alloy Processed by Tube High-Pressure Shearing

Microstructural Evolution and Tensile Testing of a Bi–Sn (57/43) Alloy Processed by Tube High-Pressure Shearing

Analysis of Sn-Bi Solders: X-ray Micro Computed Tomography Imaging and Microstructure Characterization in Relation to Properties and Liquid Phase Healing Potential

Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

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