Improved thermal conductivity of thermoplastic polyurethane via aligned boron nitride platelets assisted by 3D printing

Liu, Junchao; Li, Weiwei; Guo, Yufeng; Zhang, Hui; Zhang, Zhong

doi:10.1016/j.compositesa.2019.02.026

Cited by 148 publications

(107 citation statements)

References 23 publications

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“…It should be noted that the enhancement of thermal conductivity of the 3D printed PLA composites is higher than previous studies, which utilized metal-or carbon-based fillers in the 3D printed polymer composites. [37][38][39][40][41][42][43] For example, the printed Cu(50 wt%)/ABS composites showed only 41% improvement on thermal conductivity compared to that of bare ABS resin. 28 The enhancement on thermal conductivity of PMMA beads-Cu/PLA composites implies a segregation effect of Cu particles in the 3D printed structures.…”

Section: Characterizationmentioning

confidence: 99%

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

Jeong

Kim

et al. 2020

J of Applied Polymer Sci

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Poly(lactic acid) (PLA) composite filaments with different copper (Cu) contents as high as 40 and 20 wt% of poly(methyl methacrylate) (PMMA) beads have been fabricated by twin-screw extruder for 3D printing. A fuseddeposition modeling (FDM) 3D printing technology has been used to print the PLA composites containing hybrid fillers of Cu particles and PMMA beads. The morphology, mechanical, and thermal properties of the printed PLA composites were investigated. The tensile strength was slightly decreased, but storage modulus and thermal conductivity of PLA composites were significantly improved by adding Cu particles in the presence of PMMA beads. The PLA composites with hybrid fillers of 40 wt% of Cu particles and 20 wt% of PMMA beads resulted in thermal conductivity of 0.49 W m −1 K −1 which was three times higher than that of the bare PLA resin. The facilitation of the segregated network of high-thermally conductive Cu particles with the PMMA beads in PLA matrix provided thermally conductive pathways and resulted in a remarkable enhancement in thermal conductivity.

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Section: Characterizationmentioning

confidence: 99%

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

Jeong

Kim

et al. 2020

J of Applied Polymer Sci

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“…Among these ceramic fillers, hexagonal boron nitride ( h -BN) with a two-dimensional (2D) layered structure stands out owing to its excellent thermal conductivity (250–300 W m −1 K −1 ), low thermal expansion coefficient, stable crystal structure, low dielectric constant, high resistivity, and non-toxic properties [ 19 , 20 ]. Liu et al reported that high thermal conductive h -BN filled TPU composites can be enhanced with 2-time by controlling the alignment level of h -BN through a fused deposition modeling 3D printing technique, but it is only limited along the printing direction [ 21 ].…”

Section: Introductionmentioning

confidence: 99%

Generation of Self-Assembled 3D Network in TPU by Insertion of Al2O3/h-BN Hybrid for Thermal Conductivity Enhancement

Chi

et al. 2021

Materials

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Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing.

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“…Substantial efforts have been devoted to align the fillers, especially for anisotropic materials like BN into the composite using different strategies such as electrospinning, [16,17] stretching, [18] doctor blading [19] induced by magnetic field, [20][21][22] electric field, [23,24] gravitational force field, [25,26] and 3D printing technology. [27] Freeze-casting method is also a promising approach to form highly ordered structures of fillers inside the composite. The fillers are aligned along the ice crystal growth direction, and a small amount of fillers can build continuous thermally conductive networks inside the composite.…”

Section: Introductionmentioning

confidence: 99%

Highly Ordered BN_⊥–BN_⊥ Stacking Structure for Improved Thermally Conductive Polymer Composites

Ghosh

Grant

et al. 2020

Adv Elect Materials

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The substantial heat generation in modern electronic devices is one of the major issues requiring efficient thermal management. This work demonstrates a novel concept for the design of thermally conducting networks inside a polymer matrix for the development of highly thermally conductive composites. Highly ordered hexagonal boron nitride (hBN) structures are obtained utilizing a freeze‐casting method. These structures are then thermally sintered to get a continuous network of BN⊥–BN⊥ of high thermal conductivity in which a polymer matrix can be impregnated, enabling a directional and thermally conducting composite. The highest achieved thermal conductivity (K) is 4.38 W m−1 K−1 with a BN loading of 32 vol%. The effect of sintering temperatures on the K of the composite is investigated to optimize connectivity and thermal pathways while maintaining an open structure (porosity ≈ 2.7%). The composites also maintain good electrical insulation (volume resistivity ≈ 1014 Ω cm). This new approach of thermally sintering BN⊥–BN⊥ aligned structures opens up a new avenue for the design and preparation of filler alignment in polymer‐based composites for improving the thermal conductivity while maintaining high electrical resistance, which is a topic of interest in electronic packaging and power electronics applications.

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Improved thermal conductivity of thermoplastic polyurethane via aligned boron nitride platelets assisted by 3D printing

Cited by 148 publications

References 23 publications

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

Generation of Self-Assembled 3D Network in TPU by Insertion of Al2O3/h-BN Hybrid for Thermal Conductivity Enhancement

Highly Ordered BN_⊥–BN_⊥ Stacking Structure for Improved Thermally Conductive Polymer Composites

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Improved thermal conductivity of thermoplastic polyurethane via aligned boron nitride platelets assisted by 3D printing

Cited by 148 publications

References 23 publications

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

Generation of Self-Assembled 3D Network in TPU by Insertion of Al2O3/h-BN Hybrid for Thermal Conductivity Enhancement

Highly Ordered BN⊥–BN⊥ Stacking Structure for Improved Thermally Conductive Polymer Composites

Contact Info

Product

Resources

About

Highly Ordered BN_⊥–BN_⊥ Stacking Structure for Improved Thermally Conductive Polymer Composites