Analyzing
the wetting behavior of silver on a diamond substrate
is crucial prior to joining and printing diamond chips in electronics,
bioimplants, and cutting tool industries. This paper used molecular
dynamics models to overcome the hydrophobic behavior. It was observed
that the hydrophilic character was well promoted when a nanosolder
block of silver was collided at a certain velocity on a diamond substrate
in a hydrodynamic state rather than when it was stationary and then
heated on diamond. Hydrodynamic wetting led to rapid spreading, which
in turn elucidated a high rate of change in contact area to the highest
11 832 Å2 and a high rate of decrease in contact
angle to the lowest 23° at the highest contact velocity of 19.7
km/s in minimum time. Therefore, hydrodynamic wetting has a leading
margin for silver coating on diamond surfaces over temperature, slab
separation, and hydrostatic wetting. This paper provides theoretical
insights for effective thin-film development in the least possible
time and with the lowest solder consumption.