Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO₂–H₃PO₄–H₂SO₄ Colloid

Abstract

The present study aimed to evaluate the surface etching of the acrylonitrile-butadiene-styrene (ABS) resin in the MnO2-H3PO4-H2SO4 colloid. To enhance the soluble Mn(IV) ion concentration and improve the etching performance of ABS resin, H3PO4 was added as a complexing agent into the MnO2-H2SO4 etching system. The effects of the H2SO4 concentration and etching time on the surface topography, surface roughness, adhesion strength, and the surface chemistry of the ABS substrates were investigated. The optimal oxidation potentials of MnO2 in the colloids decreased from 1.426 to 1.369 V with the addition of H3PO4. Though the etching conditions changed from 70 °C for 20 min to 60 °C for 10 min, the adhesion strength between the ABS substrates and electroless copper film increased from 1.19 to 1.33 KN/m after etching treatment. This could be attributed to the significant increase of the soluble Mn(IV) ion concentration in the MnO2-H3PO4-H2SO4 colloid. The surface chemistry results demonstrated that the oxidation reaction of -C═C- bonds in the polybutadiene phase was accelerated in the etching process by the addition of H3PO4, and the abundant -COOH and -OH groups were formed rapidly on the ABS surface with the etching treatment. These results were in agreement with the results of surface scanning electron microscopic observations and adhesion strength measurement. The results suggested that the MnO2-H3PO4-H2SO4 colloid was an effective surface etching system for the ABS surface roughness.

Electroless Deposition of Ni-P on Poly (ether ether ketone)/Multi-Walled Carbon Nanotubes Composite and Improvement of the Electrical Conductivity in Direction of Thickness

“…Generally the surface with good wettability is benefit to the absorption of metal catalysts. [25][26][27] However, in this study, the wettability was decreased with swelling and sonicating treatment. Especially for the sonicated swelled sample, the surface was hydrophobic with a water contact angles higher than 120 • .…”

Layer by layer electroless deposition: An efficient route for preparing adhesion-enhanced metallic coatings on plastic surfaces

“…Fig. 8 demonstrated typical measurement result of 90°peel test and the adhesive strength was up to 25 N/cm, while the adhesion by traditional etching method was only 13.3 N/cm [35]. After peel test, ABS surfaces are observed by SEM and the surface appearances are shown in Fig.…”

Robust Conductive Micropatterns on PTFE Achieved via Selective UV-Induced Graft Copolymerization for Flexible Electronic Applications

“…After electroless plating for 1 h, the film was washed with distilled water and dried in a vacuum oven at 40 °C. The composition of the electroless copper plating solution was similar to that in the literature . The pH of the solution was adjusted to 12.5 using NaOH, and the bath temperature was 70 °C.…”

“…The composition of the electroless copper plating solution was similar to that in the literature. 42 The pH of the solution was adjusted to 12.5 using NaOH, and the bath temperature was 70 °C. After electroless plating for 30 min, the film was washed with distilled water and dried in a vacuum oven at 40 °C.…”