2011
DOI: 10.1039/c1ce05147d
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Improvement of crystal quality HVPE grown GaN on an H3PO4 etched template

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Cited by 30 publications
(19 citation statements)
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“…This method avoids ex situ processing to separate GaN layer from substrate before or after the growth. This is very different from the ones reported before such as mechanical lapping of sapphire 11 , laser lift-off 12 , chemical etching 13 , void assisted separation 14 and ELOG 15 . Moreover, due to the small interaction stress between GaN and the SiC substrate, the SiC substrate was excellent without damage after the whole process so that it can be repeatedly used in the GaN growth.…”
contrasting
confidence: 90%
“…This method avoids ex situ processing to separate GaN layer from substrate before or after the growth. This is very different from the ones reported before such as mechanical lapping of sapphire 11 , laser lift-off 12 , chemical etching 13 , void assisted separation 14 and ELOG 15 . Moreover, due to the small interaction stress between GaN and the SiC substrate, the SiC substrate was excellent without damage after the whole process so that it can be repeatedly used in the GaN growth.…”
contrasting
confidence: 90%
“…This method of stress control is performed accurately not only with the two different templates examined in this study, but also in the case of templates with different types of stress cited in our previous work. 24,25…”
Section: Discussionmentioning
confidence: 99%
“…To reduce the residual stress and realize the self-separation of GaN crystals, our group has explored several methods, including wet chemical etching 19 , high temperature annealing 20 , 21 and electrochemical etching methods 22 , to fabricate the nanoporous GaN buffer layer. However, the wet chemical etching method and the high temperature annealing method cannot be well controlled because of the anisotropic chemical activity of GaN crystal 23 .…”
Section: Introductionmentioning
confidence: 99%