“…As a consequence, the performance of heteroepitaxial-GaN-film-based devices is deteriorated to some extent by extended defects. To solve this inherent problem of high density dislocation in heteroepitaxially-grown-GaN-film-based devices, many approaches such as epitaxial lateral overgrowth [4], multiple intermediate layers [5], liquid phase epitaxy [6,7] have been proposed. Due to complicate processes and insufficient reduction of dislocation density in these approaches, alternative methods have been, however, constantly pursued.…”