Improvement of Fundamental Technology of 3-D Thermal Compression Bonding With High Accuracy

The morphology, especially the flatness, became more and more crucial for successful flip-chip (FC) bonding for large format detector array. For the first time an in-situ method to evaluate the flatness of bonding samples was established by linking the machine parameter and the sample attribute. The derived collimator correlation was justified by detector array and then it was used as a criterion to examine the accuracy of the bonder’s laser leveling module. The combination of the collimator correlation and the laser leveling results could theoretically show more in-situ details of the morphology and can be utilized as either a selection yardstick or a compensation canon before FC bonding. However, whether or not the vacuum system of the bonder had an impact on the morphology could not be decided at present configuration.

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An in-situ Evaluation Method for the Morphology of Large Format Detector Array

Huang

Lin

2020

J. Phys.: Conf. Ser.

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Modelling the effect of vacuum on the morphology for large format detector arrays

Huang

Lin

2021

J. Phys.: Conf. Ser.

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A Monolithic Force Sensing Integrated Flexure Bonder Dedicated to Flip-Chip Active Soft-Landing Interconnection

Tang

Zhu

et al. 2021

IEEE/ASME Trans. Mechatron.

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Improvement of Fundamental Technology of 3-D Thermal Compression Bonding With High Accuracy

Cited by 3 publications

References 21 publications

An in-situ Evaluation Method for the Morphology of Large Format Detector Array

An in-situ Evaluation Method for the Morphology of Large Format Detector Array

Modelling the effect of vacuum on the morphology for large format detector arrays

A Monolithic Force Sensing Integrated Flexure Bonder Dedicated to Flip-Chip Active Soft-Landing Interconnection

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