Improvement of Photoresist Planarization Properties by Thermal Cure: Role of the PAC

Schiltz, A.; Abraham, P.; Dechenaux, E.

doi:10.1149/1.2100403

Cited by 19 publications

(6 citation statements)

References 12 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As is demonstrated in Fig. 26 A ood exposure with a specic dosage in ambient atmosphere before reow is adequate to transform some portion of PAC to indene carboxylic acid and hence facilitates the reowing process. We attribute this phenomenon to the complex chemical reactions of the photoresist materials with the UV light.…”

Section: Resultsmentioning

confidence: 97%

“…25 The formation of ester-linkage, which gives rise to some degree of crosslinking, can hinder the resin from reowing to its own limit. 26 A ood exposure with a specic dosage in ambient atmosphere before reow is adequate to transform some portion of PAC to indene carboxylic acid and hence facilitates the reowing process. It is found that although the ood exposure helps to reduce the dips, a spherical lens shape still cannot be formed even using a high ood exposure dosage.…”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

A novel thermal reflow method for the fabrication of microlenses with an ultrahigh focal number

Wang

et al. 2015

RSC Adv.

View full text Add to dashboard Cite

In this paper, we demonstrate a novel thermal reflow method with an additional near ultraviolet (UV) flood exposure and upside-down reflow configuration for the fabrication of microlenses with an ultrahigh focal number. By using this method, microlenses with a focal number (F # ) as high as 9.7 have been successfully obtained, which is about four fold higher than that can be fabricated with a conventional reflow method.The final profile of the microlenses can be flexibly and accurately tuned by controlling the flood exposure dosage and adopting the appropriate reflow configuration, which enables fabrication not only of spherical microlenses but also of more complex aspheric lenses. The fabricated microlens is characterized by measuring the point spread function (PSF) and the measurement result indicates that the diffraction limited optical performance of the microlens can be achieved. The method developed in this work can be used for the mass and cost-effective fabrication of high performance microlenses with ultrahigh focal numbers, which can find applications such as in accurate optical testing, integration imaging, and laser beam collimating.

show abstract

Section: Resultsmentioning

confidence: 97%

Section: Resultsmentioning

confidence: 99%

A novel thermal reflow method for the fabrication of microlenses with an ultrahigh focal number

Wang

et al. 2015

RSC Adv.

View full text Add to dashboard Cite

show abstract

“…15,18 Thus, planarization enhancement during baking occurs only locally, typically over a range of about 10 pm. 13 Polyimides may also undergo these reactions during baking (curing).…”

Section: Spin Coating and Planarizationmentioning

confidence: 99%

“…More importantly, these films typically shrink by large amounts during the curing process which degrades any planarization that may have occurred due to thermal flow.8111, 14,15 Thus, commerical positive photoresists and polyimides are poor choices as planarizing materials when high degrees of planarization over large spatial areas (> 50 um) are required.…”

Section: Spin Coating and Planarizationmentioning

confidence: 99%

Spin Coating And Planarization

Stillwagon

Larson

Taylor

1987

Advances in Resist Technology and Processing IV

View full text Add to dashboard Cite

This paper reports the results of a study of topographic substrate planarization with films applied by a spin-coating process.We show that spin coating produces conformal film profiles over gaps on the substrate with widths greater than about 50 pm and that filling of these gaps can only occur after spinning has ceased provided the film is able to flow over large distances. A comparison of the major forces acting on the film leads to the conclusion that the flow is driven primarily by capillary forces when the width of the gap is less than 5000 pm. A theory is developed that relates the time required to fill the gaps to their width and to the thickness and viscosity of the film. The results of experiments performed to test the theory are presented and discussed.

show abstract

“…Several planarization investigations on sub-micron patterned substrate have been reported [3]- [13] . In these literatures, influences of processes such as pattern/feature size, spin speed for material coating, and film thickness for planarization were mainly discussed and the discussion about the effect of material properties such as solution viscosity for planarization was not so detailed [4], [6], [9] . Recently, some reports which focused on new materials to obtain a good planarization surface by spin coating of the materials on a topo-patterned substrate have been disclosed [14], [15] .…”

Section: Introductionmentioning

confidence: 99%

Spin-on organic hardmask for topo-patterned substrate

et al. 2014

View full text Add to dashboard Cite

Carbon rich hard mask underlayer (UL) material deposition has become inevitable process in all advanced lithography applications. UL processes which include chemical vapor deposition (CVD) and spin-on UL play a very important role for pattern transfer from patterned thin photoresist to the substrate. UL materials must satisfy several requirements, which have become more demanding with device shrinkage and increasing device complexity (FinFET, 3D integration). The most important properties of next generation UL materials are superior wiggle resistance, etch controllability, thermal resistance, planarization, and gap filling performance. In particular, planarization and gap fill properties of UL material for application on topo-patterned substrate are receiving much attention recently. CVD processes generally give better wiggle performance and thermal resistance, but poorer planarization and gap filling performance than spin-on UL processes. In addition, Cost of Ownership (CoO) of CVD process is higher than that of a spin-on UL process. Therefore spin-on organic hard mask (OHM) process has been investigated as an attractive alternative to CVD processing. In this paper, we focus on an investigation of key properties of spin-on UL materials for achieving good planarity and gap filling performance on topo-patterned substrate. Various material properties such as solution viscosity, glass transition temperature (Tg), and film shrinkage ratio were evaluated and correlations between these properties and planarization were discussed.

show abstract

Improvement of Photoresist Planarization Properties by Thermal Cure: Role of the PAC

Cited by 19 publications

References 12 publications

A novel thermal reflow method for the fabrication of microlenses with an ultrahigh focal number

A novel thermal reflow method for the fabrication of microlenses with an ultrahigh focal number

Spin Coating And Planarization

Spin-on organic hardmask for topo-patterned substrate

Contact Info

Product

Resources

About