Improving package assembly process yield for complex high density flip chip applications

Solberg, Vern; Oganesian, V.

doi:10.1109/eptc.2009.5416579

Search citation statements

Order By: Relevance

Paper Sections

Select...

Fig 1 Ssd Dispensing Technique [4]1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2013

Publication Types

Select...

Article1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

(1 citation statement)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…An initial design package of SSD for a semiconductor integrated circuit (IC) is less complicated and well established; hence, using the design package produced very less reject [6]. However, with recent New Product Introduction (NPI) development towards maximizing the die size while remaining the device foot print [7], solder short becomes the biggest contributor to the overall die attach yield. Figure 3 illustrates the solder short phenomena for a down set leadframe type package.…”

Section: Fig 1 Ssd Dispensing Technique [4]mentioning

confidence: 99%

Solder Short Reject Reduction in Soft Solder Die Attach (SSD) Process Using Mechanical Solder Shield Design

Rashid

Yow²,

Saad

et al. 2013

AMM

View full text Add to dashboard Cite

This paper presents a development of mechanical solder shield, which was integrated to the Soft Solder Dispenser (SSD) die attach machine. The innovation of the mechanical shield has proven its ability to prevent the molten solder overflows to the lead area of the device. As a result, it reduced number of solder short defects. The manufacturing assembly yield is maintained at the highest level; ensuring fitness for function and production cost of the product remain competitive.

show abstract

Section: Fig 1 Ssd Dispensing Technique [4]mentioning

confidence: 99%