Improving the electrical properties of structural epoxy resin adhesives

Darwish, S.M.; Niazi, Abdolkarim; Ghania, A. M. M.; Kassem, Mohamed

doi:10.1016/0143-7496(91)90059-q

Cited by 27 publications

(20 citation statements)

References 1 publication

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“…From 1998 to 1990, [22,25,37] mixed a lot of fillers (metallic powders, chopped wires and metallic fine meshes) and came up with recommended formula for improving electrical as well as thermal properties of structural epoxy adhesives. The addition of 10% graphite, 15% aluminum or 20% copper powder by weight normally improves electrical conductivity) [25]. For weld-bond specimens (flow-in technique), the adhesive was spread over the overlap length, with the thickness recommended by the manufacturer (0.5 mm).…”

Section: Weld-bond Test Specimensmentioning

confidence: 99%

Science of Weld: Adhesive Joints

Darwish

2010

Advanced Structured Materials

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Weldbonding is a combination of resistance spot welding and adhesive bonding. It is a hybrid process that combines the advantages of the two individual processes. There are two techniques for conducting weldbonds: the flow-in and the weld-through techniques. The weldbonding procedure provides many advantages, e.g.: improved crash performance, fatigue behavior and corrosion resistance. The degree of acceptance of weld-bond applications has been increasing, as the process has been understood and its mechanical properties developed. The present chapter addresses both techniques (flow-in and weld through) from implementation to modeling, including analysis and characterization. Practical implications as well as fields of application are also highlighted.

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Section: Weld-bond Test Specimensmentioning

confidence: 99%

Science of Weld: Adhesive Joints

Darwish

2010

Advanced Structured Materials

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“…In general, the use of smaller size particles increases their ease of distribution into the resin, and reduces their tendency to settle [4]. The filler volume fraction also affects the handling characteristics for the composite resin in terms of its rheology, particle wetting and ultimate mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure

Gomatam¹,

Sancaktar²

2004

Journal of Adhesion Science and Technology

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Electronically conductive adhesives (ECAs) have received a great deal of attention in recent years for interconnection applications. Even though ECAs have excellent potential for being efficient and less costly alternative to solder joining in electronic components, they still suffer from a number of problems relative to durability and design to meet specific needs. These include issues with the formulations of the conductive adhesive and its interactions with the substrate surface. In order to study these problems, we prepared two different adherends varying in surface characteristics and bonded them with three different conductive adhesive formulations with varying particle loadings, shapes and sizes of conductive nickel fillers. Joints were also prepared with two different adhesive thicknesses, and the effects were discussed in Part I of this paper. This part discusses the effects of filler surface properties, volume fraction and bonding under different levels of pressure to gain insight into the influence of these parameters on the joint strength, deformation and joint conductivity. Our results showed that chemical etching of particles, which changes the shape of the particles, has a profound effect on the joint strength, deformation and electrical conduction behavior. We note that prolonged period of chemical etching of spherical Ni-110 particles with hydrochloric acid causes irregularities in the shape of the nickel particles, and an increase of 60% in the joint resistance. Higher bonding pressure generally resulted in lower failure load and ultimate displacement values, indicating the possibility of squeeze flow for the neat resin under high pressure. Incorporation of larger particles in the adhesive formulation yielded a more efficient resin squeeze mechanism.

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“…Weld-bonded joints were first developed and used in USSR in planes of the type AN-24 [1][2][3][4][5][6][7][8]. The Soviet Union initially perfected this technology, which is known there as "glue welding".…”

Section: Introductionmentioning

confidence: 99%

“…In comparison with mechanical fasteners, weld-bonding offers the following benefits [1][2][3][4][5][6][7][8]:…”

Section: Introductionmentioning

confidence: 99%