Thermal stresses developed in weld-bonded joints

Darwish, S.M.; Al-Samhan, Ali M.

doi:10.1016/j.jmatprotec.2004.04.334

Cited by 22 publications

(13 citation statements)

References 6 publications

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“…5, which consists of 89934 hexahedral grid elements. In order to save computation time, certain aspects of the structure such as complex geometry and thin layers can be simplified or assumed negligible, which will not significantly affecting the results [7]. Under temperature cycling condition, the stress and strain analysis of MEMS device is a thermal-mechanical coupling problem.…”

Section: B Finite Element Model Of Flip-chipmentioning

confidence: 99%

The finite element analysis of solder joints under temperature cycling

Liu

Lou

Fufu

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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A thermal-mechanical coupled finite element analysis model of solder joints is established, which plays a role in mechanical support and electrical connection in flip chip. Periodic temperature cycle load (-45 ~125 ) applied on the solder joints and it will generate periodic internal stress and strain in the process of the temperature cycling. With repeat using, the solder joints will produce deformation, and then cracks, extension, interlayer delaminating. The failure of the solder joints may cause the failure of the entire switch. This paper aims to simulate the periodic changes in temperature and obtain the reliability and potential failure modes of solder joints under temperature cycling, thus providing theory reference for the design and application of the novel solid MEMS switch.

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Section: B Finite Element Model Of Flip-chipmentioning

confidence: 99%

The finite element analysis of solder joints under temperature cycling

Liu

Lou

Fufu

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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“…Nowadays many load bearing structures in automobile industries, aerospace industries, the shell of missiles, and spaceship sounders are produced by weld bonding technique. [10][11][12] Recently, studies on weld bonded structures have focused on stress distribution in the weld joint, comparison of weld bond and spot welded joints and optimization of weld bonded joints. The weld bonding experiment with full factorial design and the failure mechanism of the joints are not fully understood from the available literature.…”

Section: Introductionmentioning

confidence: 99%

Weld bonding process analysis for tensile shear strength and peel strength of weld bonded joints of dissimilar steel sheets

Boriwal

Sarviya

Mahapatra

2018

Proceedings of the Institution of Mechanical Engineers, Part E:

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Evaluating the strength performance of resistance spot welded joints in dissimilar material is critical for their continued integration into the automobile and aerospace industries. The effect of joint strength is an important consideration in the design of welded structures. The aim of this paper is to evaluate the effect of the welding process parameters (welding current, weld time, and electrode pressure) on the mechanical performance of dissimilar weld bonds between austenitic stainless steel 304L and low carbon steel sheets. Mechanical properties of weld bonds are described in terms of bond strength, failure mode, and hardness of the joint. Weld bonding experiments were planned on the basis of full factorial design matrix. Weld bonded joint strength tests showed that the maximum tensile shear strength and peel strength were achieved at 6.4 kA, eight-cycle weld time with 3 kg/cm2 electrode pressure. The hardness value across the weld bonded fusion zone was not affected much with respect to varying the welding current. Pullout failure and tearing failure modes were observed during the tensile shear strength test of weld bonded joints. Application of adhesive layer at faying surfaces resulted not only in strengthening but also distributing the stress in weld bonded joints.

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“…The FEM (Finite Element Method) simulation analysis technique is used in the present work, as it avoids the approximations of the closed-form solutions in neglecting the strain energy of certain stresses within the leads, so enabling more accurate results to be obtained [5].…”

Section: Introductionmentioning

confidence: 99%

High impact-induced failure of a novel solid MEMS switch

Wang

Lou

Yue

et al. 2013

The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems

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Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.

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Thermal stresses developed in weld-bonded joints

Cited by 22 publications

References 6 publications

The finite element analysis of solder joints under temperature cycling

The finite element analysis of solder joints under temperature cycling

Weld bonding process analysis for tensile shear strength and peel strength of weld bonded joints of dissimilar steel sheets

High impact-induced failure of a novel solid MEMS switch

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