Improving the thickness uniformity of micro electroforming layer by megasonic agitation and the application

Zhao, Ming; Du, Liqun; Xu, Zheng; Zhang, Xi; Cao, Qiang; Ji, Xuechao; Wei, Zhuangzhuang; Liu, Junshan

doi:10.1016/j.matchemphys.2019.122331

Cited by 9 publications

(9 citation statements)

References 31 publications

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“…84 The ability to uniformly distribute the thickness of an electroforming layer can be measured using throwing power. In their research, Zhao et al examined the impact of megasonic Figures 25c and 25d shows the SEM images of a microfluidic chip mold, it displays that the electroforming layer with megasonic 85 agitation has a uniform and thinner sidewall thickness than without megasonic agitation. The throwing power value increased to 50.2% at a megasonic power density of 2.4 W cm −2 , compared to 24.7% without megasonic agitation, as observed in other findings.…”

Section: = × [ ] F J B 4 L Pmentioning

confidence: 99%

“…The throwing power value increased to 50.2% at a megasonic power density of 2.4 W cm −2 , compared to 24.7% without megasonic agitation, as observed in other findings. 85 Electrohydrodynamic jet (E-Jet) electroforming.-Electrohydrodynamic jet (E-jet) printing is a highly precise printing method that utilizes electric fields to control the deposition of liquid onto a substrate. It works by creating a fluid flow in cone-jet mode through the use of electric fields to deliver ink to the substrate.…”

Section: = × [ ] F J B 4 L Pmentioning

confidence: 99%

“…Figure 25. (a) Electrodeposited copper bumps with a 25 μm diameter and 50 μm pitch with 250 W megasonic agitation, reproduced with permission 83 (b) SEM image of the cantilevered microstructure, reproduced with permission84 (c) SEM micrographs of the moulds without megasonic agitation (d) with megasonic agitation, reproduced with permission 85. …”

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Review—Electroforming Process for Microsystems Fabrication

Rai,

Gupta

2023

J. Electrochem. Soc.

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Being an unconventional technique of additive micro-manufacturing, electroforming has garnered significant interest by various industrial sectors because of its capability to offer advanced micro-manufacturing competences with high precision in achieving dimensional uniformity and replication accuracy at small scale. This paper reports a comprehensive review of the electroforming process as a microsystem fabrication technique. This process is superior compared to 3D printing, stereolithography, selective laser sintering, and fused deposition modeling etc., in many aspects due to its unique properties. It can deposit a wide variety of metals and alloys, including precious metals, making it appropriate for variegated applications in microfabrication domain. We cover the fundamental aspects of electroforming and its history followed by the current state of the art advancement, modelling associated with it, and its importance from industrial context. Additionally, we discuss the advantages and limitations of this technique and their respective microsystems applications. Finally, we conclude with a discussion on the future prospects and potential advancements in the field of electroforming contributing to micro-systems development.

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Section: = × [ ] F J B 4 L Pmentioning

confidence: 99%

Section: = × [ ] F J B 4 L Pmentioning

confidence: 99%

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Review—Electroforming Process for Microsystems Fabrication

Rai,

Gupta

2023

J. Electrochem. Soc.

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“…In recent years, micro-electroforming has become important technology for the fabrication of micro-metal devices in the field of microelectronics and microelectromechanical systems (MEMSs) [1]. A combination of lithography technology and electrodeposition makes it possible to fabricate metal microstructures suitable for micro-molds, micro-sensors and micro-actuators [2][3][4], which is a method that has the advantages of high precision, a wide range of processing sizes and mass production [5]. However, the thickness nonuniformity of the electroformed layer is a bottleneck problem in the fabrication of microdevices using micro-electroforming technology [5][6][7], which affects the usability of micro metal devices.…”

Section: Introductionmentioning

confidence: 99%

Improving the Thickness Uniformity of Micro Gear by Multi-Step, Self-Aligned Lithography and Electroforming

et al. 2023

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The thickness nonuniformity of an electroformed layer is a bottleneck problem for electroformed micro metal devices. In this paper, a new fabrication method is proposed to improve the thickness uniformity of micro gear, which is the key element of various microdevices. The effect of the thickness of the photoresist on the uniformity was studied by simulation analysis, which showed that as the thickness of the photoresist increased, the thickness nonuniformity of the electroformed gear should decrease due to the reduced edge effect of the current density. Differently from the traditional method performed by one-step front lithography and electroforming, multi-step, self-aligned lithography and electroforming are used to fabricate micro gear structures in proposed method, which intermittently keeps the thickness of photoresist from decreasing during processes of alternate lithography and electroforming. The experimental results show that the thickness uniformity of micro gear fabricated by the proposed method was improved by 45.7% compared with that fabricated by the traditional method. Meanwhile, the roughness of the middle region of the gear structure was reduced by 17.4%.

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“…In high aspect ratio plated through holes, the diffusion of the reactants would be constricted by the very narrow and deep holes, leading to the concentration polarizations of copper ions, which would impede the copper deposition process [6][7][8]. Although many strategies have been developed to address the above mentioned limitations [9][10][11][12], it is still challenging to realize uniform copper superfilling of the plating through a hole with high aspect ratio.…”

Section: Introductionmentioning

confidence: 99%

Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

Li³

et al. 2022

Coatings

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The uniformity and microstructure of the copper deposition in the high aspect ratio plated through holes (penetrating holes) are crucial for the performance of printed circuit board. We systematically investigated the effects of reverse pulse parameters in the period pulse reverse (PPR) plating on the uniformity and microstructure of the copper deposition, including reverse pulse frequency, reverse pulse duty cycle and reverse pulse current density. The Cu deposition behavior (throwing power) and its crystallographic characteristics, including grain size, crystallographic orientation, and grain boundary, were characterized by means of field-emission scanning electron microscopy (FE-SEM), X-ray diffractometer (XRD), and electron backscatter diffraction (EBSD). Our results clarify that the reverse pulse current density and duty ratio should be low to achieve the full filling and high uniformity of the through holes. The reverse pulse frequency of 1500 Hz would prevent the through holes to be fully filled. The copper electrodeposition in PTH prepared by double pulse electrodeposition has the good (111) surface texture and grain boundary distribution. This work demonstrated that the period pulse reverse (PPR) plating provides unique advantages in achieving the ultra-uniform copper deposition in the high aspect ratio plated through holes.

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Improving the thickness uniformity of micro electroforming layer by megasonic agitation and the application

Cited by 9 publications

References 31 publications

Review—Electroforming Process for Microsystems Fabrication

Review—Electroforming Process for Microsystems Fabrication

Improving the Thickness Uniformity of Micro Gear by Multi-Step, Self-Aligned Lithography and Electroforming

Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

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