Impurity diffusion of 113Sn and 124Sb in copper

Krautheim, G.; Neidhardt, A.; Reinhold, U.; Zehe, A.

doi:10.1016/0375-9601(79)90687-x

Cited by 14 publications

(7 citation statements)

References 5 publications

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“…Moreover, a high concentration of the alloying element was manifest at the inner void surface and in the neighborhood of voids grown to considerable size. It was confirmed experimentally that under exactly the same conditions [27,28] the formation of voids was absent in diffusion experiments. Furthermore, no void formation is found in electromigration experiments using high-purity crystalline matrix materials.…”

Section: Experimental Datasupporting

confidence: 69%

“…Thus, enrichment is to be expected for Al(Zn), Al(Mn) and Cu(Mn), and depletion for Cu(Ag), Ag(Cu), Cu(Zn) and Cu(In), as was actually observed. We point out here, that in electromigration experiments an enrichment of In-atoms around and at inner void surfaces in a single-crystal Cu-matrix was present [27], while Anthony [33] quotes a depletion of In around surface pits, in complete accord with the different action of vacancy-impurity pairs in both types of experiments. Obviously, the binding strength between a lattice-site vacancy and the solute atom plays an important role in this model, and it implies the geometrical structure in detail [46].…”

Section: Discussionmentioning

confidence: 70%

“…Such conditions are fulfilled in electromigration, but under otherwise identical conditions not in diffusion, as proven by us experimentally [27,28].…”

Section: Vacancy-solute Atom Pairing and Coalescencementioning

confidence: 77%

“…Early electromigration experiments with dilute copper alloys have shown a strong tendency to void formation when indium and silver were the alloying elements, but no void formation occurred when tin was the alloying element [27]. Moreover, a high concentration of the alloying element was manifest at the inner void surface and in the neighborhood of voids grown to considerable size.…”

Section: Experimental Datamentioning

confidence: 99%

“…Furthermore, no void formation is found in electromigration experiments using high-purity crystalline matrix materials. This suggests, that the presence of impurities is necessary in order to form voids in electromigration experiments [27,29,30], but the possible void formation depends strongly on the special chemical nature of the solute-or impurity atom if experiments with the same matrix metal but chemically different solute atoms are considered.…”

Section: Experimental Datamentioning

confidence: 99%

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A Selection Rule of Solutes for Void-Resistant Crystalline Metallic Alloys Exposed to Electromigration

Zehe

2002

Zeitschrift für experimentelle und technische Kristallographie

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This paper tries to predict electromigration resistance from basic properties of the involved atoms forming dilute alloys, and in particular of aluminium, copper and silver matrix metals with a number of chemically different solute elements. The leading property is generated by the formation of solute atom‐vacancy pairs, and its electronic charging state. A semi empirical rule is formulated, which considers the valence state of matrix‐ and solute atoms, and which allows a projection of the level of void formation or suppression during electromigration stressing. It is found, that the formation of voids is suppressed, if the valence electron number of the matrix atom and that of the alloying impurity atom sums up to an odd number. A broad literature scan was carried out indicating that there are only very few cases, where accordance between prediction and experimental result is violated. The rule is justified on microscopic considerations in the framework of the inhomogeneous electron gas model.

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Section: Experimental Datasupporting

confidence: 69%

Section: Discussionmentioning

confidence: 70%

“…Such conditions are fulfilled in electromigration, but under otherwise identical conditions not in diffusion, as proven by us experimentally [27,28].…”

Section: Vacancy-solute Atom Pairing and Coalescencementioning

confidence: 77%

Section: Experimental Datamentioning

confidence: 99%

Section: Experimental Datamentioning

confidence: 99%

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A Selection Rule of Solutes for Void-Resistant Crystalline Metallic Alloys Exposed to Electromigration

Zehe

2002

Zeitschrift für experimentelle und technische Kristallographie

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Enhancement effects of diffusion and impurity correlation coefficient in diluted Cu(Sn) alloys

Reinhold

Neidhardt

Krautheim

et al. 1980

Phys. Stat. Sol. (a)

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The solvent and solute enhancement factors in Cn(Sn) alloys are studied for Sn concentrat,ions up to 2.86 at?; in the temperature ranges of 797.3 to 921.4 "C and of 759.4 to 908.4 "C. respectively. The calculated enhancement factors are b?" = 56.5 t.0 38.0 and bi' = 3893 to 2349 for solvent diffusion and bf"= 36.8 to 37.8 for solute diffusion in the corresponding temperature ranges. In order t o determine the correlation factor, fi. of impiirit,y diffusion a modified method is proposed. The resiilt,ing correlation coefficients aref? = 0.31 at T = 797.3 "C andf, = 0.46 a t T = 921.4 "C. Solvent-wid Solu t,e-Erhohiingsfaktoren aerden in Cu(Sn)-Legiernngen fur Zinnkonzentrationen zwischen 0 iind 2,86 At?!, in den Temperatiirbereichen 797.3 und 921,4 "C, sowie 759,4 und 908,4 "C untersucht. Die berechneten Erhohungsfaktoren sind by" = 66.5 bis 38,O und 7 1 ; ' ' = 3893 bis 2349 fur ,,Solvent"-Diffusion und b:" = 35,8 bis 37,8 fur ,.Solute"-Diffusion in den genaniiten Temperaturbereichen. Zur Ermittlung des Korrelationsfakt,ors ii der Fremddiffusion wird eine modifizierte Methode vorgeschlagen. Die erhakenen Korrelat ionsfakt,oren sind f 2 = 0,31 bei T = = 797,3 "C undf? = 0,46 bei T = 921,4 "C.

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3.2.11 Noble metals

LeClaire¹,

Neumann²

Landolt-Börnstein - Group III Condensed Matter

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Impurity diffusion of 113Sn and 124Sb in copper

Cited by 14 publications

References 5 publications

A Selection Rule of Solutes for Void-Resistant Crystalline Metallic Alloys Exposed to Electromigration

A Selection Rule of Solutes for Void-Resistant Crystalline Metallic Alloys Exposed to Electromigration

Enhancement effects of diffusion and impurity correlation coefficient in diluted Cu(Sn) alloys

3.2.11 Noble metals

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