2020
DOI: 10.1049/iet-cds.2018.5509
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In‐depth analysis of the static behaviour of a SiC MOSFET and of its associated parameters using both compact modelling and physical simulation

Abstract: In this study, the authors aim at investigating the static electro-thermal behaviour of two new generations of power silicon carbide metal oxide semiconductor field effect transistors (SiC MOSFETs). The studied devices are commercialised and have a vertical structure. Two approaches are followed: device modelling and physical simulation. An improved compact model based on an accurate method of parameters extraction is introduced. The simulation results obtained with this method perfectly fit the measurements. … Show more

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Cited by 2 publications
(1 citation statement)
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“…Detailed electrothermal modelling techniques for power semiconductor devices can be categorized into five types based on literature: (a) behavioural model [26], [46], [47], (b) physical model [48], [49], (c) semi-physical model (i.e., PSpice or SaberRD/ SaberEXP) [50]- [52], (d) numerical model (i.e., numerical tools such as ISE TCAD and MEDICI) [53], [54] and (e) semi-numerical model [55]. The physical models are represented by the composition of the internal layers of the semiconductors [48], [49]. They are accurate, but precise information about the internal structure of the device is required during modelling.…”
Section: F Detailed Electro-thermal Modelling and Validation Of The Ibc At Full Load Conditionmentioning
confidence: 99%
“…Detailed electrothermal modelling techniques for power semiconductor devices can be categorized into five types based on literature: (a) behavioural model [26], [46], [47], (b) physical model [48], [49], (c) semi-physical model (i.e., PSpice or SaberRD/ SaberEXP) [50]- [52], (d) numerical model (i.e., numerical tools such as ISE TCAD and MEDICI) [53], [54] and (e) semi-numerical model [55]. The physical models are represented by the composition of the internal layers of the semiconductors [48], [49]. They are accurate, but precise information about the internal structure of the device is required during modelling.…”
Section: F Detailed Electro-thermal Modelling and Validation Of The Ibc At Full Load Conditionmentioning
confidence: 99%