In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

Liebens, M.; Jourdain, Anne; Vos, Joeri De; Vandeweyer, T.; Miller, Andy; Beyne, Eric; Li, S.; Bast, Gerhard; Stoerring, M.; Hiebert, S.; Cross, Andrew

doi:10.1109/asmc.2017.7969255

Cited by 5 publications

(1 citation statement)

References 3 publications

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“…1,2) As for advanced packaging technologies such as three-dimensional stacked ICs (3DS-ICs), [3][4][5][6][7] multichip modules (MCMs), [8][9][10][11] and fan-out wafer level packages (FOWLPs), [12][13][14][15] the base silicon of ICs tends to be highly thinned for greater form factor. 16) In such advanced packages, the reduced heat conductance of thin silicon increases thermal resistance which prevents heat dissipation. This heat accumulation in thinned LSIs leads to a steeper thermal gradient than in full-thickness LSIs, as shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

Investigation of transient thermal dissipation in thinned LSI for advanced packaging

Araga¹,

Shimamoto²,

Melamed³

et al. 2018

Jpn. J. Appl. Phys.

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Thinning of LSI is necessary for superior form factor and performance in dense cutting-edge packaging technologies. At the same time, degradation of thermal characteristics caused by the steep thermal gradient on LSIs with thinned base silicon is a concern. To manage a thermal environment in advanced packages, thermal characteristics of the thinned LSIs must be clarified. In this study, static and dynamic thermal dissipations were analyzed before and after thinning silicon to determine variations of thermal characteristics in thinned LSI. Measurement results revealed that silicon thinning affects dynamic thermal characteristics as well as static one. The transient variations of thermal characteristics of thinned LSI are precisely verified by analysis using an equivalent model based on the thermal network method. The results of analysis suggest that transient thermal characteristics can be easily estimated by employing the equivalent model.

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