2021
DOI: 10.1016/j.actamat.2021.117290
|View full text |Cite
|
Sign up to set email alerts
|

In-situ mapping of local orientation and strain in a fully operable infrared sensor

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
3
0

Year Published

2022
2022
2023
2023

Publication Types

Select...
3

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(3 citation statements)
references
References 30 publications
0
3
0
Order By: Relevance
“…[6][7][8] In the SWIR photodetectors and imaging sensors, narrow-bandgap semiconductor materials are the key components, and of vital important. Mercury cadmium telluride (HgCdTe), [9,10] indium antimonide (InSb), [11,12] indium gallium arsenide (InGaAs), [13,14] Si, [15,16] and germanium (Ge) [17,18] are typical representatives of narrow-bandgap semiconductor bulk materials, which have been widely used in infrared detecting. However, with the rapid growth in demand for human wearable electronic devices, the aforementioned bulk materials have seriously hindered the develo pment of civil consumer electronics due to many challenges involving epitaxial growth devices, high material toxicity, and the inability to achieve flexible devices manufacturing.…”
Section: Short-wave Infrared Photodetectors and Imaging Sensors Based...mentioning
confidence: 99%
“…[6][7][8] In the SWIR photodetectors and imaging sensors, narrow-bandgap semiconductor materials are the key components, and of vital important. Mercury cadmium telluride (HgCdTe), [9,10] indium antimonide (InSb), [11,12] indium gallium arsenide (InGaAs), [13,14] Si, [15,16] and germanium (Ge) [17,18] are typical representatives of narrow-bandgap semiconductor bulk materials, which have been widely used in infrared detecting. However, with the rapid growth in demand for human wearable electronic devices, the aforementioned bulk materials have seriously hindered the develo pment of civil consumer electronics due to many challenges involving epitaxial growth devices, high material toxicity, and the inability to achieve flexible devices manufacturing.…”
Section: Short-wave Infrared Photodetectors and Imaging Sensors Based...mentioning
confidence: 99%
“…Over the years, many diffraction-based 3D mapping approaches have been developed and used, but they have several limitations; for example, electron-microscopy methods (Liu et al, 2011) are destructive, and 3D X-ray diffraction (Poulsen et al, 2001;Poulsen, 2004) and diffraction contrast tomography (Ludwig et al, 2009) are restricted by the detector to a spatial resolution of 1 mm. However, dark-field X-ray microscopy (DFXM) is non-destructive (Yildirim et al, 2021), is very well suited to simultaneous multiscale characterization (Simons et al, 2015) or in situ measurements (Yildirim et al, 2021), and can achieve direct spatial resolutions of 30-100 nm (Kutsal et al, 2019) and a time resolution of 100 ms (Holstad et al, 2022). The application of this technique has been largely demonstrated for metallurgical studies (Maziarz et al, 2010), fuel cells (Longo et al, 2020) and biominerals (Cook et al, 2018), and it is only rarely performed on microelectronics devices (Jakobsen et al, 2019).…”
Section: Introductionmentioning
confidence: 99%
“…Among the other particularities of this technique is its ability to provide 3D mapping of strain and orientations in crystalline materials at the nanoscale and to generate a real-space image of the illuminated volume. The European Synchrotron Radiation Facility (ESRF) provides advanced techniques to study matter at the nanoscale with DFXM at the ID06-HXM beamline (Yildirim et al, 2021). The energy ranges from 11 to 55 keV with a minimum beam size of 30.0  0.5 mm 2 (h  v) and a maximum beam size of 2.0  0.5 mm 2 (h  v).…”
Section: Introductionmentioning
confidence: 99%