Increasing the Efficiency of Screen-Printed Silicon Solar Cells by Light-Induced Silver Plating

Mette, A.; Schetter, C.; Wissen, D.; Lust, S.; Glunz, Stefan W.; Willeke, G.

doi:10.1109/wcpec.2006.279322

Cited by 66 publications

(45 citation statements)

References 3 publications

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“…The first layer is printed in an aerosol jet system by Optomec #7 and the second layer is processed by light induced plating. 8 During plating in a cyanide plating bath approximately 10 mm of silver has grown on the fired seed layer resulting in a line width of about 50 mm and a contact height of about 10 mm. A cross section of such a contact structure is depicted in Figure 3.…”

Section: Front Contact Formationmentioning

confidence: 99%

“…After firing of this seed layer, the second metal layer is electrochemically plated e.g., by light induced plating (LIP). 8 In this paper, we combine the advantage of an optimized rear side with the benefit of an industrially feasible two-step front side metallization and achieving an average efficiency of 20% over seven cells on one wafer. Neither the formation of a selective emitter nor the opening on a dielectric layer is necessary.…”

Section: Introductionmentioning

confidence: 99%

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Fine line printed silicon solar cells exceeding 20% efficiency

Hörteis

Glunz

2008

Progress in Photovoltaics

104

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Silicon solar cells with passivated rear side and laser-fired contacts were produced on float zone material. The front side contacts are built up in two steps, seed and plate. The seed layer is printed using an aerosol jet printer and a silver ink. After firing this seed layer through the silicon nitride layer, the conductive layer is grown by light induced plating. The contact formation is studied on different emitter sheet resistances, 55 V/sq, 70 V/sq, and on 110 V/sq. These emitters are passivated with a PECVD silicon nitride layer which also acts as an antireflection coating. Even on the 110 V/sq emitters it was possible to reach a fill factor of 80Á1%. The electrical properties i.e., the contact resistance of the front side contacts are studied by transfer length model (TLM) measurements. On a cell area of 4 cm 2 and emitter sheet resistance of 110 V/sq, a record efficiency of 20Á3% was achieved. Excellent open-circuit voltage (V oc ) and short-circuit current ( j sc ) values of 661 mVand 38Á4 mA/ cm 2 were obtained due to the low recombination in the 110 V/sq emitter and at the passivated rear surface. These results show impressively that it is possible to contact emitter profiles with a very high efficiency potential using optimized printing technologies.

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Section: Front Contact Formationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Fine line printed silicon solar cells exceeding 20% efficiency

Hörteis

Glunz

2008

Progress in Photovoltaics

104

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“…9 In this paper, a novel metal aerosol jet printing technique is introduced to create the seed layer. This technique is different to the ink jet set up, 5 which are used for metallization 10,11 and structuring. 12 The line width can be close to that of photolithographically defined lines of evaporated metals, whereas material exploitation is significantly increased and process complexity is reduced by the direct-write technology.…”

Section: Seed Layer and Platingmentioning

confidence: 99%

“…5 This implies the great advantage that both layers can be optimized individually. If the line width of the first layer is sufficiently narrow, excellent aspect ratios of 1:2 to 1:3 can be achieved.…”

Section: Introductionmentioning

confidence: 99%

Metal aerosol jet printing for solar cell metallization

Mette

Richter

Hörteis

et al. 2007

Progress in Photovoltaics

Self Cite

197

101

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Metal aerosol jet printing is a new non-contact direct-write technique for the front side metallization of highly efficient industrial silicon solar cells. With this technique the first layer of a two-layer contact structure is created. It features a low contact resistance and good mechanical adhesion to the silicon surface. The second layer is formed by light-induced silver plating (LIP) to increase the line conductivity. To form the first layer a metal-containing aerosol is created in the printer and focused via a second surrounding gas stream through a nozzle and deposited onto the substrate. The focussing gas avoids the contact between the aerosol and the nozzle tip. In addition, line widths significantly smaller than the outlet diameter of the nozzle tip can be reached. Fine and continuous lines with a width of 14 mm were printed using a metal organic ink. As the adhesion of these layers was not sufficient, a commercially available screen-printing paste for solar cell metallization was modified and tested. Monocrystalline silicon solar cells of 12Á5 cm T 12Á5 cm with an aluminum back surface field were processed, achieving energy conversion efficiencies up to 17Á8%.

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“…In order to improve electrical properties of the front electrode, various fabrication techniques are being analyzed (Figure 1), consisting in different imprint techniques and its final connection with the substrate surface. This paper summarizes recent testing with metallization in the front using a conventional Screen Printing The screen printing method used during printing of silver paste on the front surface of silicon wafer [3]- [6]- [7].…”

Section: Introductionmentioning

confidence: 99%