Induced delamination of silicon-molding compound interfaces

Schlottig, Gerd; Pape, H.; Wunderle, Bernhard; Ernst, L.J.

doi:10.1109/esime.2009.4938478

Cited by 10 publications

(8 citation statements)

References 11 publications

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“…For the experimental interface fracture evaluation a new setup, the Mixed Mode Chisel setup (MMC, [7]) was used, Figure 1. The specimens were designed to ensure close-to production process flow.…”

Section: Methodsmentioning

confidence: 99%

Interface fracture mechanics evaluation by correlation of experiment and simulation

Keller

Maus

Schlottig

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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Interface fracture mechanics is one of the main focuses of electronics reliability research. Determination of fracture mechanical properties of interface cracks is a substantial task for design for reliability comcept. Without experimental determined fracture mechanical parameters such as the critical energy release rate a reliability forecast based on simulation results cannot be given. In fracture mechanics testing often a correct measurement of the crack tip location is needed for the calculation of the energy release rate. The authors present a combined simulative and experimental method for crack tip location determination of typical interface specimens. The specimens are loaded in a newly designed testing apparatus, the Mixed Mode Chisel (MMC) setup, and images of the crack tip at the interface are taken at different load states during the testing procedure. Then images are analyzed by image correlation techniques (DAC, deformation analysis by correlation) and cra ck tip displacement fields are determined. In the next analysis step the displacement fields are compared to fields from finite element analysis of the same specimen geometry with boundary conditions similar to the experimental setup. The point of the best matching of the experimental and simulative field is the actual crack tip location. If finite-element data or analytical solution for the crack tip displacement field is available the method can be applied for a variety of different interface samples

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Section: Methodsmentioning

confidence: 99%

Interface fracture mechanics evaluation by correlation of experiment and simulation

Keller

Maus

Schlottig

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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“…7). As there are no standards, one might as well be inventive: Some interesting approaches are on the way (Schlottig et al 2009;Shirangi et al 2009a, b;Ernst et al 2008). Especially for interface test specimens preparation is of extreme importance.…”

Section: Delaminationmentioning

confidence: 98%

Lifetime modelling for microsystems integration: from nano to systems

Wunderle

Michel

2009

Microsyst Technol

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Due to the rapid development of IC technology the traditional packaging concepts are making a transition into more complex system integration techniques in order to enable the constantly increasing demand for more functionality, performance, miniaturisation and lower cost. These new packaging concepts (as e.g. system in package, 3D integration, MEMS-devices) will have to combine smaller structures and layers made of new materials with even higher reliability. As these structures will more and more display nano-features, a coupled experimental and simulative approach has to account for this development to assure design for reliability in the future. A necessary ''nano-reliability'' approach as a scientific discipline has to encompass research on the properties and failure behaviour of materials and material interfaces under explicit consideration of their micro-and nano-structure and the effects hereby induced. It uses micro-and nano-analytical methods in simulation and experiment to consistently describe failure mechanisms over these length scales for more accurate and physically motivated lifetime prediction models. This paper deals with the thermo-mechanical reliability of microelectronic components and systems and methods to analyse and predict it. Various methods are presented to enable lifetime prediction on system, component and material level, the latter promoting the field of nano-reliability for future packaging challenges in advanced electronics system integration.

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“…Connected to the simplified observavtion at the sample edge is also the following thought. We found a profile of delamination front differing from a straight line across the interface [6], this shape needs an initial cracking area to fully develop. Short crack lengths, where the delamination starts to propagate, might conflict with the developing profile.…”

Section: Short Crack Lengths Should Be Excludedmentioning

confidence: 98%

“…Despite the difficulties to apply the findings of conventional engineering to the electronic packaging challenges, new methods were demonstrated to extract fracture mechanical parameters of a range of material parings [5]. For the Silicon to Epoxy Molding Compound (EMC) interface -a comparably stiff and brittle combination -the new Mixed Mode Chisel setup (MMC, [6]) was successfully developed and tested. Also methods to fabricate the corresponding specimens from production-relevant processing were shown [7].…”

Section: Introductionmentioning

confidence: 99%

Interfacial fracture parameters of silicon-to-molding compound

Schlottig

Maus

Walter

et al. 2010

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

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The rapid diversification in microelectronics forebodes more complex system integration, be it for denser function integration or a span of dimensions between various technologies. Products may include more features, perform faster and be cheaper. With these trends the amount of material layers is increasing. This challenges development to a faster rating of material pairings. Delamination is a major issue among the related reliability aspects. When the design or testing steps are accompanied by simulation, fracture mechanical descriptions are increasingly proving helpful. The parameters needed for simulation have to be measured and should be available for different fracture mode mix angles. We investigated the interfacial fracture toughness of the Epoxy Molding Compound (EMC) to Silicon interface. Although difficult to delaminate we could carry out measurements using the Mixed Mode Chisel setup (MMC) that allowed us to induce different stress states at the crack tip at various external load angles. The samples we derived from the molding process of embedded wafer level ball grid arrays. Therefore we were able to use samples made with the same process as in real packaging. The crack tip position was determined by analysis of displacement results by digital image correlation. In order to interpret the sample reaction for extracting fracture mechanical parameters, adequate numerical modeling and simulation was required. The experiments provided the parameters for the models. Establishing the residual stress state in the materials preceded the interface delamination simulation: a two step interpretation. Residual stresses cannot be neglected; indeed they are part of the challenges to delaminate this interface at all. We found energy release rates increasing with fracture mode mix, and such values close to pure tensile opening at the crack tip. We recommend to exclude data from short crack lengths and to carefully expose the sample flanks. The results promise to extend - - the available interfacial fracture data soon

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Induced delamination of silicon-molding compound interfaces

Cited by 10 publications

References 11 publications

Interface fracture mechanics evaluation by correlation of experiment and simulation

Interface fracture mechanics evaluation by correlation of experiment and simulation

Lifetime modelling for microsystems integration: from nano to systems

Interfacial fracture parameters of silicon-to-molding compound

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