Influence of Ag content on the formation and growth of intermetallic compounds in Sn–Ag–Cu solder

Bai, Hailong; Zan, Long; Chen, Junyu; Gu, Xing; Jinmei, L; Zhao, Lingyan; Chen, Dongdong; Jin, Yan

doi:10.1007/s10854-020-03556-8

Cited by 7 publications

(2 citation statements)

References 21 publications

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“…This is because the value is obtained from 2D cross-section analysis using the average linear intercept method. 36,37 Smith 33 discusses the growth mechanism in terms of grain growth topology in terms of space filling and surface tension. A hexagonal 2D grain that consists of six sides is stable with side angles of 120°.…”

Section: Introductionmentioning

confidence: 99%

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Linear growth behaviour of intermetallic compound layer in electronic interconnections

Bakar,

Jalar,

Alias

2024

Science and Technology of Welding and Joining

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We observed a linear behaviour of intermetallic compound (IMC) layer growth in electronic metallurgical interconnections, although the time required was twice that of commercial reliability standards for electronic packaging. This finding contradicts the classical parabolic growth law, which is widely reported to represent growth behaviour. We suggest that the parabolic growth law may be inadequate to thoroughly explain the IMC layer's growth by considering (a) one-directional growth and (b) reactions between elements for formation and growth. Further analysis has been carried out to analyse the logical judgment of the parabolic growth law and support our finding over linear IMC layer growth behavior.

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Section: Introductionmentioning

confidence: 99%

“…This is because the value is obtained from 2D cross-section analysis using the average linear intercept method. 36,37…”

Section: Introductionmentioning

confidence: 99%