A quantum-tunneling metal-insulator-metal (MIM) diode is fabricated by atmospheric pressure chemical vapor deposition (AP-CVD) for the first time. This scalable method is used to produce MIM diodes with high-quality, pinhole-free Al 2 O 3 films more rapidly than by conventional vacuum-based approaches. This work demonstrates that clean room fabrication is not a prerequisite for quantum-enabled devices. In fact, the MIM diodes fabricated by AP-CVD show a lower effective barrier height (2.20 eV) at the electrodeinsulator interface than those fabricated by conventional plasma-enhanced atomic layer deposition (2.80 eV), resulting in a lower turn on voltage of 1.4 V, lower zero-bias resistance, and better asymmetry of 107.The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/adfm.201805533. dielectric layer sandwiched between two metal contacts. MIM diodes are capable of rectification in the high frequency range due to a femtosecond quantum-tunneling electron transport mechanism through the insulator, making them attractive for applications in solar rectennas, [1] infrared detectors, [2,3] and wireless power transmission. [4] However, the insulator layer in the MIM stack, which plays a crucial role in determining the diode performance, [5] is typically deposited using vacuum-based methods, such as sputtering, [6] anodic oxidation of sputtered films, [7] electron beam deposition, [8] and especially atomic layer deposition (ALD), [9] which is commonly used due to its ability to deposit nanoscale films with high accuracy and uniformity. High-throughput fabrication of MIM diodes is limited by slow deposition rates and the need for a vacuum environment. Scalable techniques are therefore needed for depositing nanoscale films for the next generation of integrated quantum devices. Some deposition processes have been introduced to fabricate thin films at atmospheric pressure for nanoelectronic devices that utilize quantum phenomena. Thermal and anodic oxidation, for example, have been used to grow thin CrO x and Nb 2 O 5 films on Cr and Nb layers for MIM diodes [7,10] ; atmospheric pressure metal organic vapor phase epitaxial growth (AP-MOVPE), or atmospheric pressure metal organic chemical vapor deposition (AP-MOCVD), has been used to fabricate InGaAsP multiquantum-well structures for optical devices [11] ; the Langmuir Blodgett technique was used to deposit a ZnO film for a MIM diode [12] ; and a chemical vapor deposition (CVD) furnace operated at atmospheric pressure has been used to deposit a TiO 2 film in a tunneling transistor. [13] The need for high temperatures, specific metal films for oxidation, and complex compound precursors in these techniques, as well as challenges in reproducibility, highlight the need for new methods to reliably deposit enabling films for cost-effective quantum devices. Recently, atmospheric pressure spatial atomic layer deposition (AP-SALD) systems have been utilized to grow uniform films for different applications including solar cells...