Influence of Cold Rolling on Diffusion Bondability of SUS316L Stainless Steel Sheets

Abstract

The influence of cold rolling on diffusion bondability has been systematically investigated using SUS316L stainless steel sheets with different reduction ratios (0, 35, 50 and 70%) as specimens. According to the results of tensile testing of diffusion bonds, highly rolled sheets exhibit enhanced diffusion bondability. This phenomenon is discussed from the viewpoint of the microstructure.

Reduction of Diffusion Bonding Temperature with Recrystallization at Austenitic Stainless Steel

“…Harumoto et al 7) reported the reduction of the bonding temperature by pre-working the austenitic stainless steel, but did not report a mechanism responsible for the reduction in bonding temperature. Moreover, for titanium alloys, Han et al 8) regarded the mechanism as an increase in the grain boundary diffusion, which leads to fine grains due to localized severe plastic deformation and recrystallization.…”

Thermal Stress-Based Diffusion Bonding Method: the Case of Oxygen Free Copper to 316L Stainless Steel

“…The details the apparatus are in our previous report. 15) Briefly, 10 MPa compressive pressure was applied to the SUS316L/OFC bonding couple, and the apparatus was evacuated using a turbo molecular pump. After reaching a high vacuum (³ 2 © 10 ¹3 Pa), the bonding couple was heated at a rate of 100 K/min and kept at the bonding temperature for 120 min using 7.5 kW high-frequency induction heating system (FIH-702; Fuji Electric Industrial Co. Ltd., Japan).…”

Accelerative Effects of Diffusion Bonding of Recrystallization with Reversion of Deformation-induced Martensite in SUS304

“…In a previous study, we suggested a process that can accelerate the diffusion bonding at low temperature by introducing a large amount of strain into austenitic stainless steel before bonding , 4) and reported that pre-distorted SUS304 with deformation-induced martensite can be bonded at 973 K. 4) Bonding temperature is reportedly decreased by introducing strain into SUS304, 5) SUS316L. 6) Although the cause of such a decrease in diffusion-bonding temperature is not well understood, possible causes are the effects of accelerating the grain boundary diffusion due to grain refinement and accelerating the lattice diffusion due to recrystallization. Additionally, in the case of SUS304, reversion of deformation-induced martensite is expected to affect the diffusion bonding behavior.…”