Influence of composition on corrosion behavior of as-cast Cu–Zr alloys in HCl solution

Corrosion behavior and porous structure formation of sputtered Cu–Zr nanostructured films

“…4(a) displays the potentiodynamic polarization curves of the Cu-Zr nanostructured films with 15, 30 and 44 at.% Zr, respectively, which are composed of different phase constituents. Similar polarization curves have been observed for the coarse-grain Cu-Zr alloys [12] and the glassy Cu-Zr ribbons [19][20][21]. It can be seen that there is a significant difference between the cathodic polarization regimes of the films.…”

“…Based on these results, it can be concluded that the dealloying behavior depends strongly on the composition of the investigated alloys. Our recent work [12] has also showed that the dissolution rate of Zr in the coarse-grained Cu-Zr alloys is remarkably enhanced when the Zr content increases from 15 to 30 at.%, whereas there is no obvious change in the corrosion rate when the Zr content ranges from 30 to 66 at.%. Though the dealloying process occurs in the coarse-grained Cu-Zr alloys (15-66 at.% Zr), no porous structure can be formed after dealloying.…”

Pitting corrosion of Cu–Zr metallic glasses in hydrochloric acid solutions

“…A similar active dissolution of Cu-Zr alloys with 38-85 at.% Cu has been observed at different structural states, i.e. microcrystalline [21,22], nanocrystalline [19,23] and amorphous [14]. It is also noted that the anodic polarization curves almost overlap with each other, that means, the potentiodynamic polarization measurements may not be sufficient to determine differences in the susceptibility of the alloys to corrosion in HCl solution.…”

“…4. In general, an increase of the Cu content in Cu-Zr alloys can raise the hydrogen evolution rate (HER) due to the electro- catalytic properties of the element [14,21]. For the present Cu-Zr metallic glasses, the cathodic current density increases when the Cu content is raised from 40 to 50 at.%, whereas it has no significant change from 50 to 60 at.% Cu.…”

Use of Local Electrochemical Methods (SECM, EC-STM) and AFM to Differentiate Microstructural Effects (EBSD) on Very Pure Copper

“…Till now corrosion was often consider as a purely chemical interaction with an exclusive dependence on compositional effects, while ignoring microstructural and crystallographic properties of the metal surface [4][5][6][7][8][9][10][11]. Some recent literature data, however, suggest an important effect of microstructural elements such as grain size, crystallographic orientation and grain boundary characteristics features on the electrochemical behavior [12][13][14][15][16][17][18][19][20][21][22].…”