Influence of diamond content and milling duration on microstructure and thermal conductivity of Ti-coated diamond/copper composite coating on copper substrate

Sun, Jing; Zang, Jiajun; Li, Huan; Feng, Xiaomei; Shen, Yifu

doi:10.1016/j.matchemphys.2020.124017

Cited by 16 publications

(7 citation statements)

References 38 publications

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“…The interface layer formed serves as a bridge connecting copper and diamond, thereby increasing the composite’s TC. Sun et al [ 27 ] reported that the copper/diamond composites with titanium-coated diamond particle composites were synthesized by mechanical alloying, after annealing at 800 °C, the TC of a 40 vol.% diamond/copper composite reached 409 W/mK. The titanium-coating combination to the surface metallization of diamond particles helps to improve the copper/diamond interface and obtains a high TC within the composite material.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Titanium and Copper-Coated Diamond/Copper Composites via Selective Laser Melting

Zhang

et al. 2022

Micromachines

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The poor wettability and weak interfacial bonding of diamond/copper composites are due to the incompatibility between diamond and copper which are inorganic nonmetallic and metallic material, respectively, which limit their further application in next-generation heat management materials. Coating copper and titanium on the diamond particle surface could effectively modify and improve the wettability of the diamond/copper interface via electroless plating and evaporation methods, respectively. Here, these dense and complex composites were successfully three-dimensionally printed via selective laser melting. A high thermal conductivity (TC, 336 W/mK) was produced by 3D printing 1 vol.% copper-coated diamond/copper mixed powders at an energy density of 300 J/mm3 (laser power = 180 W and scanning rate = 200 mm/s). 1 and 3 vol.% copper-coated diamond/copper composites had lower coefficients of thermal expansions and higher TCs. They also had stronger bending strengths than the corresponding titanium-coated diamond/copper composites. The interface between copper matrix and diamond reinforcement was well bonded, and there was no cracking in the 1 vol.% copper-coated diamond/copper composite sample. The optimization of the printing parameters and strategy herein is beneficial to develop new approaches for the further construction of a wider range of micro-sized diamond particles reinforced metal matrix composites.

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Section: Introductionmentioning

confidence: 99%

Fabrication of Titanium and Copper-Coated Diamond/Copper Composites via Selective Laser Melting

Zhang

et al. 2022

Micromachines

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“…The R is closely related to the chemistry and physics properties of materials on both sides of the interface . The low chemical affinity between carbon materials and Cu leads to interfacial defects that increase phonon scattering at the interface and thereby decrease the phonon transmission efficiency . Furthermore, molecular dynamics (MD) studies have demonstrated that the significant dissimilarity of phonon vibrational properties between carbon materials and Cu causes a large R (>10 m 2 K/GW) .…”

Section: Introductionmentioning

confidence: 99%

Superior Thermal Conductivity of Graphene Film/Cu-Zr Alloy Composites for Thermal Management Applications

Guo

Wang

Zhang

et al. 2022

ACS Appl. Mater. Interfaces

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As the power density of electronic devices continuously increases, there is a growing demand to improve the heat conduction performance of thermal management materials for addressing heat dissipation issues. Single-/few-layer graphene is a promising candidate as a filler of a metal matrix due to its extremely high thermal conductivity (k); however, the well-arranged assembly of 2D-component graphene with a high volume fraction remains challenging. Herein, we integrated a novel graphene-based macroscopic material of graphene film (GF) into a Cu matrix by infiltrating molten Zr-microalloyed Cu into a spirally folded and upright-standing GFs skeleton. The microstructure of the GF/Cu composites was regulated by an interface modification strategy. The GF/Cu composites with a spirally layered microstructure exhibit a superior k of 820 W/m K in the axial direction, much higher than that of Cu-matrix composites reinforced with graphene nanosheets (generally <500 W/m K) and twice that of Cu. The thermal transfer mechanisms were investigated by experiments and theoretical calculations. The results reveal that the excellent performance is attributed to the construction of high-heat conduction channels and a positive coordinating effect at the Zr-modified GF/Cu interface. Meanwhile, the relation between interfacial microstructure and heat transfer is established in the composites using interfacial thermal resistance as a bridge. This work yields in-depth insight into the heat conduction mechanism in highly oriented structures and provides a promising solution for the thermal management issues of high-power electronics.

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“…Besides, it has been reported that nanocomposite with grain size ranging from 5 to 50 nm [ 20 , 21 , 22 , 23 , 24 , 25 ] and dislocation densities around 1015–1016 mm −3 can be obtained by MA [ 26 ]. Moreover, a recently developed method combining both powder metallurgy (PM) and MA has produced very excellent results on the mechanical properties of various Cu-based composite systems [ 27 , 28 , 29 , 30 , 31 ].…”

Section: Introductionmentioning

confidence: 99%

In Situ Tungsten Carbide Formation in Nanostructured Copper Matrix Composite Using Mechanical Alloying and Sintering

Yusoff

Hussain

2022

Materials

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In this study, an in situ nanostructured copper tungsten carbide composite was synthesized by mechanical alloying (MA) and the powder metallurgy route. The microstructure and phase changes of the composite were characterized by X-ray diffraction, scanning electron microscopy and X-ray photoelectron spectroscopy. Tungsten carbide phases (WC and W2C) were only present after MA and combination of sintering. Higher energy associated with a longer milling time was beneficial for the formation of WC. Formation of W2C and WC resulted from internal refinement due to heavy plastic deformation in the composite. The solubility of the phases in the as-milled and sintered composite was described by the changes of the lattice parameter of Cu. Chemical analysis of the surface of a composite of W 4f and C 1s revealed that the increased defects introduced by MA affect the atomic binding of the W-C interaction.

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Influence of diamond content and milling duration on microstructure and thermal conductivity of Ti-coated diamond/copper composite coating on copper substrate

Cited by 16 publications

References 38 publications

Fabrication of Titanium and Copper-Coated Diamond/Copper Composites via Selective Laser Melting

Fabrication of Titanium and Copper-Coated Diamond/Copper Composites via Selective Laser Melting

Superior Thermal Conductivity of Graphene Film/Cu-Zr Alloy Composites for Thermal Management Applications

In Situ Tungsten Carbide Formation in Nanostructured Copper Matrix Composite Using Mechanical Alloying and Sintering

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