2022
DOI: 10.1088/1361-6595/aca9f7
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Influence of magnetic field strength on capacitively coupled CF4 discharge at different pressures

Abstract: The influence of a homogeneous magnetic field parallel to the electrodes on the plasma properties and electron heating mode was investigated by a one-dimensional PIC/MCC simulations in electronegative CF4 discharges. The discharge conditions are Z = 3.5 cm, f = 13.56 MHz, V0 = 300 V, and the various gas pressure of 10 mTorr, 100 mTorr and 200 mTorr. It is found that, in the absence of a magnetic field, the discharges are electronegative at different pressures and the electronegativity is stronger at higher pre… Show more

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Cited by 3 publications
(4 citation statements)
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“…In this study, our team developed an open source 1D3V PIC/MC code [22], developed in Fortran code, to investigate the gas discharge process CF 4 . This code has been completed in series work, such as the breakdown process of CF 4 /SF 6 RF-CCP [23,24] and Ar dual-frequency (DF) CCP [25], MAE of CF 4 RF-CCP [17], IB RF-CCP [19] and EB RF-CCP [21].…”
Section: Pic/mc Modementioning
confidence: 99%
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“…In this study, our team developed an open source 1D3V PIC/MC code [22], developed in Fortran code, to investigate the gas discharge process CF 4 . This code has been completed in series work, such as the breakdown process of CF 4 /SF 6 RF-CCP [23,24] and Ar dual-frequency (DF) CCP [25], MAE of CF 4 RF-CCP [17], IB RF-CCP [19] and EB RF-CCP [21].…”
Section: Pic/mc Modementioning
confidence: 99%
“…The electron is difficult to achieve high energy of the dissociative ionization for creating CF + 2 , CF + , C + , F + . Thus, only electrons and F − , CF + 3 , CF − 3 are the mainly charged particles that must be calculated in CF 4 simulation [17,23,32]. Therefore, in our simulation code, four types of charged particles are considered.…”
Section: Pic/mc Modementioning
confidence: 99%
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“…The use of plasma etching for patterning thin film layers for the manufacturing of integrated circuits is of increasing importance [3]. Such etch processes [4][5][6] typically use electronegative gases such as CF 4 , C 4 F 8 , and SF 6 [7][8][9]. With the increase in complexity of such applications and the reduction of the minimum feature size of individual circuit elements, empirical methods fail and a detailed fundamental understanding of the plasma physics of such discharges is required as a basis for knowledge based plasma process development.…”
Section: Introductionmentioning
confidence: 99%